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PGA900AYZST

Texas Instruments

PGA900AYZST by Texas Instruments

PGA900AYZST by Texas Instruments is a 36-terminal analog circuit IC with a supply voltage range of 3.3V to 30V. Operating b/w -40°C to 150°C, it features a very thin profile and fine pitch package style for automotive applications. The package body material is plastic/epoxy, making it suitable for surface mount assembly with a rectangular shape and bottom terminal position.

Median Price

$7.908

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,990 parts In-Stock

1+ parts

$7.908

100+ parts

$6.447

1k+ parts

$4.298

10k+ parts

-

9,990

$7.908

$6.447

$4.298

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 53 parts In-Stock

1+ parts

$5.680

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$5.680

-

-

-

Digiode

USA . 4,160 parts In-Stock

1+ parts

$7.513

100+ parts

-

1k+ parts

-

10k+ parts

-

4,160

$7.513

-

-

-

Vyrian

USA . 6,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,012

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,318 parts In-Stock

1+ parts

$5.680

100+ parts

-

1k+ parts

-

10k+ parts

$5.566

3,318

$5.680

-

-

$5.566

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.680

100+ parts

-

1k+ parts

$5.396

10k+ parts

$5.282

100

$5.680

-

$5.396

$5.282

Ampacity Inc.

Singapore . 4,896 parts In-Stock

1+ parts

$6.720

100+ parts

-

1k+ parts

-

10k+ parts

-

4,896

$6.720

-

-

-

Corphita

USA . 1,394 parts In-Stock

1+ parts

$7.117

100+ parts

-

1k+ parts

-

10k+ parts

-

1,394

$7.117

-

-

-

Parana Technologies

USA . 1,409 parts In-Stock

1+ parts

$19.245

100+ parts

$1,787.224

1k+ parts

$17.321

10k+ parts

-

1,409

$19.245

$1,787.224

$17.321

-

Microchip USA

USA . 1,627 parts In-Stock

1+ parts

$20.660

100+ parts

$20.370

1k+ parts

$20.220

10k+ parts

$20.070

1,627

$20.660

$20.370

$20.220

$20.070

DigiPath Technology Company

USA . 1,648 parts In-Stock

1+ parts

$21.192

100+ parts

$19.496

1k+ parts

-

10k+ parts

-

1,648

$21.192

$19.496

-

-

ChromeModa Solutions

Germany . 1,202 parts In-Stock

1+ parts

$21.624

100+ parts

$17.732

1k+ parts

-

10k+ parts

-

1,202

$21.624

$17.732

-

-

IDEA Electronic Components Group

UK . 838 parts In-Stock

1+ parts

$21.624

100+ parts

$20.543

1k+ parts

$19.462

10k+ parts

-

838

$21.624

$20.543

$19.462

-

Argo Parts USA

USA . 4,097 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,097

-

-

-

-

Overview

Unleash the power of precision with the PGA900AYZST by Texas Instruments. Crafted with unmatched quality and expertise, this innovative product is a game-changer in the world of semiconductor technology. Ideal for a variety of applications, this gem offers unparalleled value to customers seeking reliability and performance. Elevate your projects with the PGA900AYZST and experience the cutting-edge advantages it brings to the table. Trust Texas Instruments for excellence, trust the PGA900AYZST for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a good balance of cost-effectiveness and durability.

Surface Mount: YES

Being surface mountable allows for easier assembly and efficient use of PCB space.

Nominal Supply Voltage (Vsup): 5 V

Compatibility with a standard supply voltage simplifies circuit design and integration.

Maximum Operating Temperature: 150 °C

Ability to operate at high temperatures makes this product suitable for various environments.

Width (mm): 3.59 mm

Compact width allows for space-efficient placement on a PCB.

Other IC type: ANALOG CIRCUIT

Analog circuit functionality expands the range of applications this product can be used for.

Minimum Supply Voltage (Vsup): 3.3 V

Support for a lower supply voltage offers flexibility in power requirements.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering during assembly.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliability in challenging operating conditions.

Maximum Supply Voltage (Vsup): 30 V

Wide supply voltage range enables compatibility with various power sources.

Technical Specifications

Other Function Semiconductors PGA900AYZST attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B36

JESD-609 Code:

e1

Length:

3.715 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

3.3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.59 mm

Trade Compliance

PGA900AYZST Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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