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PGA900AYZSR

Texas Instruments

PGA900AYZSR by Texas Instruments

PGA900AYZSR by Texas Instruments is a 36-terminal analog circuit IC with a package style of grid array, very thin profile, and fine pitch. It operates in automotive-grade temperatures from -40 to 150°C, with supply voltage ranging from 3.3V to 30V. Ideal for automotive applications requiring precise analog functions in compact spaces.

Median Price

$6.591

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,136 parts In-Stock

1+ parts

$6.591

100+ parts

$5.373

1k+ parts

$3.582

10k+ parts

-

7,136

$6.591

$5.373

$3.582

-

DigiKey

USA . 368 parts In-Stock

1+ parts

$11.980

100+ parts

$8.040

1k+ parts

$7.973

10k+ parts

-

368

$11.980

$8.040

$7.973

-

Arrow

USA . 51,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.862

51,000

-

-

-

$4.862

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 66 parts In-Stock

1+ parts

$4.734

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$4.734

-

-

-

Digiode

USA . 2,254 parts In-Stock

1+ parts

$6.261

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

$6.261

-

-

-

Vyrian

USA . 19,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,391

-

-

-

-

TME

Poland . 10,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.748

10,500

-

-

-

$5.748

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,128 parts In-Stock

1+ parts

$2.714

100+ parts

-

1k+ parts

$3.198

10k+ parts

-

2,128

$2.714

-

$3.198

-

DigiPath Technology Company

USA . 1,918 parts In-Stock

1+ parts

$2.989

100+ parts

$2.750

1k+ parts

-

10k+ parts

-

1,918

$2.989

$2.750

-

-

ChromeModa Solutions

Germany . 3,280 parts In-Stock

1+ parts

$3.050

100+ parts

$2.501

1k+ parts

-

10k+ parts

-

3,280

$3.050

$2.501

-

-

IDEA Electronic Components Group

UK . 617 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

$2.745

10k+ parts

-

617

$3.050

-

$2.745

-

Ampacity Inc.

Singapore . 19,499 parts In-Stock

1+ parts

$4.130

100+ parts

-

1k+ parts

-

10k+ parts

-

19,499

$4.130

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$4.734

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.734

-

-

-

Continental Prestige Electronics

USA . 16 parts In-Stock

1+ parts

$4.734

100+ parts

-

1k+ parts

-

10k+ parts

$4.639

16

$4.734

-

-

$4.639

Corphita

USA . 2,054 parts In-Stock

1+ parts

$5.932

100+ parts

-

1k+ parts

-

10k+ parts

-

2,054

$5.932

-

-

-

Microchip USA

USA . 6,153 parts In-Stock

1+ parts

$32.380

100+ parts

$32.180

1k+ parts

$32.080

10k+ parts

$31.980

6,153

$32.380

$32.180

$32.080

$31.980

Kepictronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Lixinc

USA . 5,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,412

-

-

-

-

Argo Parts USA

USA . 3,205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,205

-

-

-

-

Overview

Experience unparalleled precision and reliability with the PGA900AYZSR by Texas Instruments, a leading manufacturer in the semiconductor industry. This cutting-edge device offers a wide range of applications in various industries, providing exceptional value and performance. With its advanced features and high-quality design, customers can trust in the PGA900AYZSR to deliver unmatched results every time. Elevate your projects with this innovative solution and unlock endless possibilities for success.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into a circuit board, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape allows for a more compact design and efficient use of board space.

No. of Terminals: 36

With a high number of terminals, this product offers a wide range of connectivity options for various applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable performance even in extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in cold environments without performance issues.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The choice of terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for soldering and ensures a stable connection.

Maximum Seated Height: 0.625 mm

The low seated height allows for a compact design and efficient use of space within a system.

Other IC type: ANALOG CIRCUIT

Analog circuit type offers precise and accurate signal processing, making it suitable for a wide range of applications.

Minimum Supply Voltage (Vsup): 3.3 V

The low minimum supply voltage requirement enables compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures that the product is not subjected to excessive heat stress during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints during assembly processes.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can withstand the temperature fluctuations and harsh environments typically found in automotive applications.

Terminal Form: BALL

Ball terminal form provides a reliable connection and allows for easy integration into the system.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density packaging and efficient use of board space.

Maximum Supply Voltage (Vsup): 30 V

The high maximum supply voltage capability makes this product suitable for a wide range of power supply requirements.

Technical Specifications

Other Function Semiconductors PGA900AYZSR attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XBGA-B36

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PGA900AYZSR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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