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PCI7412GHK

Texas Instruments

PCI7412GHK by Texas Instruments

PCI7412GHK by Texas Instruments is a bus controller with 32-bit address and external data bus width. It operates at 24.576 MHz clock frequency, supporting a max data transfer rate of 132 MBps. Ideal for PCMCIA applications, it has a low profile grid array package style and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,635 parts In-Stock

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Digiode

USA . 4,182 parts In-Stock

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4,182

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Distributors (Availability)

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AZTECH Wire

Italy . 426 parts In-Stock

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$11.706

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426

$11.706

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Parana Technologies

USA . 979 parts In-Stock

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$16.574

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$16.849

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979

$16.574

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$16.849

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ChromeModa Solutions

Germany . 5,283 parts In-Stock

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$18.622

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$15.270

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$18.622

$15.270

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IDEA Electronic Components Group

UK . 1,483 parts In-Stock

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$18.622

100+ parts

$17.691

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$16.760

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1,483

$18.622

$17.691

$16.760

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One Stop Electronics

USA . 730 parts In-Stock

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$27.000

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730

$27.000

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Corohmni

South Africa . 707 parts In-Stock

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$80.651

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707

$80.651

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DigiPath Technology Company

USA . 1,509 parts In-Stock

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$16.790

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$16.790

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Corphita

USA . 274 parts In-Stock

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Overview

Unlock seamless data transfer and unparalleled performance with the PCI7412GHK by Texas Instruments. Manufactured with precision and quality in mind, this bus controller offers a wide range of applications in the tech industry. From ensuring smooth communication between devices to enhancing overall system functionality, this product provides value, efficiency, and reliability to customers. Experience the benefits of cutting-edge technology with the PCI7412GHK and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides good durability and thermal properties, ensuring the longevity and reliability of the product.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into various electronic systems, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for greater flexibility in power supply options and compatibility with a wider range of systems.

Address Bus Width: 32

The 32-bit address bus width enables efficient data transfer and communication within the system, supporting high-speed performance.

Package Shape: SQUARE

The square shape of the package provides a uniform and compact form factor, making it easier to design and install the product in limited spaces.

No. of Terminals: 216

With a high number of terminals, the product can support complex connections and interfaces, enhancing its compatibility and functionality.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage ensures efficient power consumption and operation, contributing to energy savings and overall performance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the product to function reliably in various environmental conditions without overheating.

Maximum Data Transfer Rate: 132 MBps

The high data transfer rate enables fast and efficient communication between devices, supporting high-performance data processing.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function properly even in cold environments, improving its versatility and reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and connection process, ensuring proper alignment and secure connections within the system.

Maximum Seated Height: 1.4 mm

The low maximum seated height helps in reducing the overall profile of the product, making it suitable for compact and slim electronic devices.

Width: 16 mm

The compact width of the product allows for easy integration into various systems and devices, optimizing space utilization and design flexibility.

External Data Bus Width: 32

The 32-bit external data bus width supports high-speed data transfers and efficient communication with external devices, enhancing overall performance.

Maximum Clock Frequency: 24.576 MHz

The high maximum clock frequency enables rapid data processing and synchronization, supporting real-time operations and high-speed performance.

Length: 16 mm

The compact length of the product complements its width, providing a balanced form factor for seamless integration and optimized space utilization.

Temperature Grade: COMMERCIAL

Designed for commercial use, the product meets industry standards for temperature tolerance and reliability, ensuring consistent performance in typical operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

The specific peripheral IC type indicates the product's compatibility with PCMCIA standards and its ability to efficiently manage bus operations within the system.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and speed performance, making the product a reliable and cost-effective choice for various applications.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable contact points, ensuring stable and efficient communication within the system.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures consistent and stable power delivery, supporting reliable operation and performance of the product.

Bus Compatibility: PCI

Designed for PCI bus compatibility, the product can seamlessly integrate with a wide range of systems and devices, enhancing its versatility and applicability.

Terminal Pitch: 0.8 mm

With a tight terminal pitch of 0.8 mm, the product allows for compact and efficient connections, optimizing space usage and enhancing overall design aesthetics.

Drive Interface Standard: IEEE1394; IEEE1394A

Supporting IEEE1394 and IEEE1394A drive interface standards, the product ensures compatibility with a variety of devices and systems, enhancing connectivity options.

Technical Specifications

Bus Controllers PCI7412GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

24.576 MHz

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE1394; IEEE1394A

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B216

Length:

16 mm

No. of Terminals:

216

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI7412GHK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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