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PCI7421GHK

Texas Instruments

PCI7421GHK by Texas Instruments

PCI7421GHK by Texas Instruments is a Bus Controller with 32-bit Address Bus Width, 132 MBps Data Transfer Rate, and 48 MHz Clock Frequency. It is used in PCMCIA applications for PCI bus compatibility, featuring a low profile grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,018 parts In-Stock

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Digiode

USA . 1,537 parts In-Stock

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One Stop Electronics

USA . 1,362 parts In-Stock

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$12.000

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AZTECH Wire

Italy . 298 parts In-Stock

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$15.806

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Corohmni

South Africa . 686 parts In-Stock

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$40.098

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Parana Technologies

USA . 2,029 parts In-Stock

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$60.281

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DigiPath Technology Company

USA . 2,095 parts In-Stock

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$66.377

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$61.067

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ChromeModa Solutions

Germany . 2,196 parts In-Stock

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$67.732

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$55.540

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IDEA Electronic Components Group

UK . 1,676 parts In-Stock

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$67.732

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$64.345

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$60.959

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Lixinc

USA . 18,518 parts In-Stock

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Kepictronics

USA . 6,300 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,230 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Metaverse IC Inc.

Canada . 419 parts In-Stock

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Overview

Enhance your device's performance with the Texas Instruments PCI7421GHK Bus Controller. Manufactured with top-notch quality materials and cutting-edge technology, this product offers seamless integration and high-speed data transfer rates of up to 132 MBps. Perfect for a wide range of applications, this low-profile, fine-pitch package provides customers with unmatched value and reliability. Upgrade your system today with the PCI7421GHK and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a circuit board.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in different applications.

Address Bus Width: 32

Allows for efficient data transfer and communication between components.

Package Shape: SQUARE

Square shape allows for optimal use of space on a circuit board.

Power Supplies (V): 1.5,1.8,3.3,3.3/5

Provides a variety of voltage options to accommodate different power requirements.

No. of Terminals: 288

Ample number of terminals for connectivity and data transfer.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Provides different package styles for specific application needs.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower supply voltages.

Maximum Operating Temperature: 70 °C

Operates efficiently within a wide temperature range.

Maximum Data Transfer Rate: 132 MBps

High data transfer rate for fast and efficient communication.

Minimum Operating Temperature: 0 °C

Can function in low temperature environments without issues.

Terminal Position: BOTTOM

Bottom terminal position for easy connection and integration.

Maximum Seated Height: 1.4 mm

Low profile design for space-saving and compact installations.

Width: 16 mm

Compact width for flexible placement on a circuit board.

External Data Bus Width: 32

Matches the address bus width for efficient data transfer.

Maximum Clock Frequency: 48 MHz

Supports high clock frequency for quick data processing.

Length: 16 mm

Compact length for space efficiency in circuit board design.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating temperatures.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

Specifically designed as a bus controller for PCMCIA interfaces.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable and secure connections.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for consistent performance.

Bus Compatibility: PCI

Compatible with PCI bus systems for seamless integration.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density mounting and connectivity.

Technical Specifications

Bus Controllers PCI7421GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

132 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B288

Length:

16 mm

No. of Terminals:

288

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5,1.8,3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI7421GHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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