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PCA9535DWT

Texas Instruments

PCA9535DWT by Texas Instruments

PCA9535DWT by Texas Instruments is a 16-bit parallel I/O port with supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features CMOS technology, dual terminal position, and small outline package style for compact designs. With 24 terminals and gull wing form, it offers versatile connectivity in a compact footprint.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,462 parts In-Stock

1+ parts

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4,462

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Vyrian

USA . 3,478 parts In-Stock

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3,478

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,539 parts In-Stock

1+ parts

$1.000

100+ parts

-

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1,539

$1.000

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AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$5.890

100+ parts

-

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512

$5.890

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Corohmni

South Africa . 195 parts In-Stock

1+ parts

$17.818

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195

$17.818

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Parana Technologies

USA . 1,166 parts In-Stock

1+ parts

$54.858

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1,166

$54.858

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IDEA Electronic Components Group

UK . 327 parts In-Stock

1+ parts

$61.638

100+ parts

$58.556

1k+ parts

$55.474

10k+ parts

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327

$61.638

$58.556

$55.474

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ChromeModa Solutions

Germany . 134 parts In-Stock

1+ parts

$61.638

100+ parts

$50.543

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134

$61.638

$50.543

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DigiPath Technology Company

USA . 550 parts In-Stock

1+ parts

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100+ parts

$55.573

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550

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$55.573

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Corphita

USA . 352 parts In-Stock

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352

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Overview

Elevate your electronic projects with the PCA9535DWT by Texas Instruments, a top-tier manufacturer known for delivering high-quality solutions. This parallel I/O port offers a wide range of applications, providing customers with unparalleled flexibility and control. With its durable plastic/epoxy body and small outline package style, this device is designed to meet industrial standards. Trust Texas Instruments to deliver reliable products that exceed expectations and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs without risk of damage.

Package Shape: RECTANGULAR

Rectangular shape is common and compatible with standard PCB layouts.

No. of Bits: 16

Having 16 bits allows for a wide range of data processing and communication capabilities.

Power Supplies (V): 2.5/5

Multiple power supply options provide flexibility in voltage selection based on specific requirements.

No. of Terminals: 24

Having 24 terminals allows for multiple connection options and versatility in applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, especially in compact electronic devices.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage ensures efficient power consumption and operation in low-power systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to operate in extreme cold conditions without performance issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and reliability in connections.

No. of Ports: 2

Having 2 ports enables simultaneous data transfer or communication, increasing efficiency in data processing.

Maximum Seated Height: 2.65 mm

Low maximum seated height allows for a compact and slim design of the device.

Width: 7.5 mm

Narrow width enables the product to be installed in limited space applications.

Length: 15.4 mm

Compact length makes the product suitable for small electronic devices or systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh environmental conditions in industrial settings.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General purpose peripheral IC type makes the product versatile and suitable for various parallel I/O applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy soldering during assembly.

Nominal Supply Voltage: 3 V

Having a 3V nominal supply voltage ensures compatibility with a wide range of electronic systems and devices.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting of the product on the PCB, saving space and improving connectivity.

No. of I/O Lines: 16

16 I/O lines offer sufficient input/output capabilities for data exchange and communication in parallel operations.

Technical Specifications

Parallel I/O Ports PCA9535DWT attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

PCA9535DWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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