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MSP430FR2675TRHBT

Texas Instruments

MSP430FR2675TRHBT by Texas Instruments

MSP430FR2675TRHBT by Texas Instruments is a 16-bit microcontroller with 8-Ch 12-Bit ADC channels, offering low power mode and peripherals like BOR, RTC, and WDT. It operates b/w -40 to 105 °C with a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$4.410

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 30,050 parts In-Stock

1+ parts

$3.519

100+ parts

$3.083

1k+ parts

$1.742

10k+ parts

-

30,050

$3.519

$3.083

$1.742

-

Mouser Electronics

USA . 150 parts In-Stock

1+ parts

$5.300

100+ parts

$3.220

1k+ parts

$2.470

10k+ parts

$2.450

150

$5.300

$3.220

$2.470

$2.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,248 parts In-Stock

1+ parts

$3.343

100+ parts

-

1k+ parts

-

10k+ parts

-

4,248

$3.343

-

-

-

Vyrian

USA . 6,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,361

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 934 parts In-Stock

1+ parts

$3.167

100+ parts

-

1k+ parts

-

10k+ parts

-

934

$3.167

-

-

-

Component Stockers USA

USA . 6,919 parts In-Stock

1+ parts

$5.140

100+ parts

$3.540

1k+ parts

$1.860

10k+ parts

-

6,919

$5.140

$3.540

$1.860

-

Parana Technologies

USA . 763 parts In-Stock

1+ parts

$72.449

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$72.449

-

-

-

ChromeModa Solutions

Germany . 4,642 parts In-Stock

1+ parts

$81.403

100+ parts

$66.750

1k+ parts

-

10k+ parts

-

4,642

$81.403

$66.750

-

-

IDEA Electronic Components Group

UK . 1,534 parts In-Stock

1+ parts

$81.403

100+ parts

$77.333

1k+ parts

$73.263

10k+ parts

-

1,534

$81.403

$77.333

$73.263

-

Lixinc

USA . 19,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,985

-

-

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iodParts Technologies Inc.

India . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

-

-

-

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DigiPath Technology Company

USA . 2,108 parts In-Stock

1+ parts

-

100+ parts

$73.393

1k+ parts

-

10k+ parts

-

2,108

-

$73.393

-

-

Overview

Unlock the power of cutting-edge technology with the MSP430FR2675TRHBT microcontroller from Texas Instruments. Designed for industrial-grade applications, this versatile chip offers unparalleled performance and efficiency. With a wide range of peripherals including BOR, RTC, and timers, it provides seamless connectivity through I2C, SPI, and UART interfaces. Experience the benefits of low power mode and fast clock frequency, making it ideal for battery-operated devices. Trust in Texas Instruments' reputation for quality and innovation, and elevate your product to new heights with the MSP430FR2675TRHBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V provides flexibility in power supply options.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with existing software and tools, making it easy to integrate into projects.

ADC Channels: YES

Having ADC channels allows for analog sensor data to be easily converted and processed by the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient and fast execution of instructions, making it suitable for time-sensitive applications.

Analog To Digital Convertors: 8-Ch 12-Bit

With 8 analog to digital converters at 12-bit resolution, the microcontroller can accurately read multiple analog signals with high precision.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

Having multiple connectivity options like I2C, IRDA, SPI, and UART allows for easy communication with other devices and peripherals.

ROM Programmability: FRAM

ROM programmability using FRAM technology provides fast and reliable non-volatile memory storage for program code.

Low Power Mode: YES

Having a low power mode enables the microcontroller to conserve energy and extend battery life in power-sensitive applications.

Technical Specifications

Microcontrollers MSP430FR2675TRHBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

27

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

33280

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

3.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR2675TRHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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