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MSP430F5509IRGCR

Texas Instruments

MSP430F5509IRGCR by Texas Instruments

MSP430F5509IRGCR by Texas Instruments is a 16-bit microcontroller with 2048 RAM words and 24576 ROM words. It operates at up to 32 MHz, has 12-Ch 10-Bit ADC channels, and features connectivity options like I2C, SPI(2), UART, USB. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.975

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,997 parts In-Stock

1+ parts

$2.975

100+ parts

$2.607

1k+ parts

$1.473

10k+ parts

-

7,997

$2.975

$2.607

$1.473

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,244 parts In-Stock

1+ parts

$2.826

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

$2.826

-

-

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Vyrian

USA . 5,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,530

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,461 parts In-Stock

1+ parts

$2.678

100+ parts

-

1k+ parts

-

10k+ parts

-

2,461

$2.678

-

-

-

AZTECH Wire

Italy . 518 parts In-Stock

1+ parts

$8.190

100+ parts

-

1k+ parts

-

10k+ parts

-

518

$8.190

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-

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Parana Technologies

USA . 1,150 parts In-Stock

1+ parts

$69.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,150

$69.080

-

-

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DigiPath Technology Company

USA . 1,857 parts In-Stock

1+ parts

$76.066

100+ parts

$69.980

1k+ parts

-

10k+ parts

-

1,857

$76.066

$69.980

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-

ChromeModa Solutions

Germany . 1,131 parts In-Stock

1+ parts

$77.618

100+ parts

$63.647

1k+ parts

-

10k+ parts

-

1,131

$77.618

$63.647

-

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IDEA Electronic Components Group

UK . 183 parts In-Stock

1+ parts

$77.618

100+ parts

$73.737

1k+ parts

$69.856

10k+ parts

-

183

$77.618

$73.737

$69.856

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5509IRGCR microcontroller. Designed with precision and quality in mind, this chip is the perfect solution for a wide range of applications. With features like low power mode, analog to digital converters, and multiple peripherals including UART and USB connectivity, this microcontroller offers unparalleled value and performance. Whether you're designing industrial automation systems or consumer electronics, the MSP430F5509IRGCR is your key to unlocking endless possibilities. Choose Texas Instruments for reliability, efficiency, and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while providing adequate protection to the internal components.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs while ensuring stable operation.

ADC Channels: YES

Integrated Analog to Digital Convertors enable the microcontroller to efficiently process analog signals from external sensors or devices, expanding its functionality.

ROM Programmability: FLASH

The flash programmability of Read-Only Memory allows for easy updates and customization of firmware, enhancing the versatility of the product.

Connectivity: I2C, SPI(2), UART, USB

Multiple connectivity options make it compatible with various communication protocols, facilitating seamless integration with other devices or systems.

Speed: 25 rpm

The maximum clock frequency of 32 MHz enables high-speed processing and operation, ensuring quick response times in demanding applications.

Low Power Mode: YES

The presence of a low power mode helps in conserving energy, extending battery life and making the product suitable for applications requiring power efficiency.

Technical Specifications

Microcontrollers MSP430F5509IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART, USB

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5509IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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