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LPV324PWR

Texas Instruments

LPV324PWR by Texas Instruments

LPV324PWR by Texas Instruments is a quad operational amplifier with 4 functions. It features a max input offset voltage of 10000 uV and a nominal common mode reject ratio of 71 dB. With micropower technology, it is ideal for industrial applications requiring low bias current and high voltage gain.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,531 parts In-Stock

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Digiode

USA . 1,379 parts In-Stock

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Parana Technologies

USA . 932 parts In-Stock

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$2.344

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$2.844

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932

$2.344

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$2.844

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DigiPath Technology Company

USA . 137 parts In-Stock

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$2.581

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$2.375

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$2.581

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ChromeModa Solutions

Germany . 5,855 parts In-Stock

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$2.634

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$2.160

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IDEA Electronic Components Group

UK . 553 parts In-Stock

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$2.634

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$2.371

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One Stop Electronics

USA . 247 parts In-Stock

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$4.410

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AZTECH Wire

Italy . 656 parts In-Stock

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$15.566

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A-Z Elektronik GmbH

Germany . 6,650 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,552 parts In-Stock

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Kepictronics

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Corphita

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Microchip USA

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Overview

Experience the power of Texas Instruments with the LPV324PWR operational amplifiers. Designed for precision and reliability, this product is ideal for a wide range of applications in the industrial sector. With its advanced technology and micropower capabilities, customers can trust in the quality and performance of this amplifier. From its compact package to its low bias current, the LPV324PWR offers unmatched value and benefits for all your operational amplifier needs. Trust in Texas Instruments for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Maximum Input Offset Voltage: 10000 uV

Low input offset voltage ensures accuracy in signal processing.

Maximum Average Bias Current (IIB): 0.06 uA

Low bias current helps in maintaining stable operation and reducing power consumption.

Surface Mount: YES

Surface mount capability offers easy and quick installation on circuit boards.

No. of Functions: 4

Multiple functions support versatile application options in various circuits.

Nominal Common Mode Reject Ratio: 71 dB

High common mode rejection ratio ensures suppression of common mode noise for cleaner output signals.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V supports compatibility with standard power sources.

No. of Terminals: 14

Multiple terminals provide flexible connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Technology: BIPOLAR

Bipolar technology ensures efficient operation and high performance in signal amplification.

Technical Specifications

Operational Amplifiers (Op Amps) LPV324PWR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

2.7/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

237 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

10000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.1 V/us

Peak Bias Current:

60 nA

Maximum Bias Current (IIB) @25 °C:

50 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

5.5 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

46 μA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

LPV324PWR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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