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LP873200RHDTQ1

Texas Instruments

LP873200RHDTQ1 by Texas Instruments

LP873200RHDTQ1 by Texas Instruments is a Power Management IC with 28 terminals, operating at -40 to 125°C. It features a max output current of 2A, switching frequency of 2200 kHz, and supports automotive applications. With a compact square package style and pulse width modulation control technique, it is ideal for power supply support circuits in automotive systems.

Median Price

$2.237

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 200 parts In-Stock

1+ parts

$0.197

100+ parts

$0.187

1k+ parts

-

10k+ parts

-

200

$0.197

$0.187

-

-

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$1.480

-

-

-

Texas Instruments

USA . 2,240 parts In-Stock

1+ parts

$3.234

100+ parts

$2.834

1k+ parts

$1.601

10k+ parts

-

2,240

$3.234

$2.834

$1.601

-

DigiKey

USA . 245 parts In-Stock

1+ parts

$4.010

100+ parts

$2.518

1k+ parts

$2.274

10k+ parts

$2.182

245

$4.010

$2.518

$2.274

$2.182

Mouser Electronics

USA . 199 parts In-Stock

1+ parts

$4.010

100+ parts

$2.520

1k+ parts

$2.200

10k+ parts

$2.170

199

$4.010

$2.520

$2.200

$2.170

Rochester

USA . 178 parts In-Stock

1+ parts

-

100+ parts

$2.000

1k+ parts

$1.790

10k+ parts

$1.690

178

-

$2.000

$1.790

$1.690

Verical

USA . 178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.237

10k+ parts

$2.112

178

-

-

$2.237

$2.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,351 parts In-Stock

1+ parts

$0.187

100+ parts

-

1k+ parts

-

10k+ parts

-

3,351

$0.187

-

-

-

Vyrian

USA . 8,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,329

-

-

-

-

DigiKey Marketplace

USA . 178 parts In-Stock

1+ parts

-

100+ parts

$2.310

1k+ parts

-

10k+ parts

-

178

-

$2.310

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,647 parts In-Stock

1+ parts

$0.177

100+ parts

-

1k+ parts

-

10k+ parts

-

1,647

$0.177

-

-

-

Parana Technologies

USA . 899 parts In-Stock

1+ parts

$16.234

100+ parts

-

1k+ parts

$16.543

10k+ parts

-

899

$16.234

-

$16.543

-

DigiPath Technology Company

USA . 345 parts In-Stock

1+ parts

$17.875

100+ parts

$16.445

1k+ parts

-

10k+ parts

-

345

$17.875

$16.445

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-

ChromeModa Solutions

Germany . 3,115 parts In-Stock

1+ parts

$18.240

100+ parts

$14.957

1k+ parts

-

10k+ parts

-

3,115

$18.240

$14.957

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-

IDEA Electronic Components Group

UK . 787 parts In-Stock

1+ parts

$18.240

100+ parts

$17.328

1k+ parts

$16.416

10k+ parts

-

787

$18.240

$17.328

$16.416

-

Microchip USA

USA . 1,030 parts In-Stock

1+ parts

$19.440

100+ parts

$19.320

1k+ parts

$19.270

10k+ parts

$19.210

1,030

$19.440

$19.320

$19.270

$19.210

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Overview

Unleash the power of efficient and reliable performance with the LP873200RHDTQ1 from Texas Instruments. Crafted with precision and expertise, this Power Management IC offers seamless integration and unparalleled functionality for various applications. Elevate your projects with the cutting-edge technology and superior quality that Texas Instruments is known for. Experience the ease of use and enhanced capabilities that come with the LP873200RHDTQ1, providing value and benefits that exceed expectations. Join the ranks of satisfied customers who have unlocked the true potential of their designs with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation and protection for the internal components of the power management IC.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and cost during production.

Nominal Supply Voltage (Vsup): 3.7 V

Compatible with many electronic devices that operate within this voltage range.

No. of Terminals: 28

Provides flexibility for connecting to multiple components and circuits.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high temperature environments.

Minimum Output Voltage: 0.7 V

Allows for low voltage output applications.

Control Mode: CURRENT-MODE

Provides efficient and stable control of the output current.

Maximum Output Voltage: 3.36 V

Suitable for applications requiring higher output voltages.

Minimum Operating Temperature: -40 °C

Ensures the IC can function even in extremely cold conditions.

Terminal Finish: Matte Tin (Sn)

Provides good electrical conductivity and solderability for easy connection.

No. of Channels: 4

Allows for multiple independent outputs or functions within a single IC.

Maximum Switching Frequency: 2200 kHz

Enables fast and efficient power conversion.

Maximum Output Current: 2 A

Capable of handling higher output currents for power-hungry applications.

Control Technique: PULSE WIDTH MODULATION

Provides precise control over the output voltage.

Switcher Config: BUCK

Efficiently steps down the input voltage to the desired output voltage.

Technical Specifications

Power Management ICs LP873200RHDTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.8 V

Nominal Input Voltage:

3.7 V

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Maximum Output Voltage:

3.36 V

Minimum Output Voltage:

.7 V

Nominal Output Voltage:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2200 kHz

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+0.36, 0.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

LP873200RHDTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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