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LP8725TLX/NOPB

Texas Instruments

LP8725TLX/NOPB by Texas Instruments

LP8725TLX/NOPB by Texas Instruments is a Power Management IC with 30 terminals, supporting 9 channels and outputs. It operates at a max supply voltage of 4.5V and has a switching frequency of 4000 kHz. Ideal for industrial applications requiring precise power supply support circuits in compact spaces.

Median Price

$2.293

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 58,900 parts In-Stock

1+ parts

$2.293

100+ parts

$2.009

1k+ parts

$1.135

10k+ parts

-

58,900

$2.293

$2.009

$1.135

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,974 parts In-Stock

1+ parts

$2.178

100+ parts

-

1k+ parts

-

10k+ parts

-

3,974

$2.178

-

-

-

Vyrian

USA . 4,532 parts In-Stock

1+ parts

$2.293

100+ parts

-

1k+ parts

-

10k+ parts

-

4,532

$2.293

-

-

-

Anansix

USA . 2,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,456

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,578 parts In-Stock

1+ parts

$2.064

100+ parts

-

1k+ parts

-

10k+ parts

-

1,578

$2.064

-

-

-

Parana Technologies

USA . 250 parts In-Stock

1+ parts

$17.458

100+ parts

-

1k+ parts

$17.656

10k+ parts

-

250

$17.458

-

$17.656

-

DigiPath Technology Company

USA . 2,296 parts In-Stock

1+ parts

$19.224

100+ parts

$17.686

1k+ parts

-

10k+ parts

-

2,296

$19.224

$17.686

-

-

ChromeModa Solutions

Germany . 4,860 parts In-Stock

1+ parts

$19.616

100+ parts

$16.085

1k+ parts

-

10k+ parts

-

4,860

$19.616

$16.085

-

-

IDEA Electronic Components Group

UK . 2,270 parts In-Stock

1+ parts

$19.616

100+ parts

$18.635

1k+ parts

$17.654

10k+ parts

-

2,270

$19.616

$18.635

$17.654

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,500

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Overview

Discover the cutting-edge LP8725TLX/NOPB by Texas Instruments, a top-tier Power Management IC designed to revolutionize your electronic devices. Crafted with precision and expertise, this product boasts unbeatable quality and reliability that Texas Instruments is renowned for. With a wide range of applications in power supply support circuits, this IC offers unmatched value, efficiency, and performance. Experience seamless power management like never before with the LP8725TLX/NOPB - your ultimate solution for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the IC package.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6V supply voltage is suitable for a wide range of applications, providing stable power to the device.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high heat environments, making it suitable for industrial use.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3V ensures compatibility with various device requirements, providing sufficient power delivery.

Maximum Seated Height: 0.675 mm

The low seated height of 0.675 mm allows for compact and slim designs, ideal for space-constrained devices.

Maximum Switching Frequency: 4000 kHz

High switching frequency of 4000 kHz allows for efficient power management and control, enhancing overall performance.

Technical Specifications

Power Management ICs LP8725TLX/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B30

JESD-609 Code:

e1

Length:

2.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

9

No. of Functions:

1

No. of Outputs:

9

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.8 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA30,5X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

4000 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+2.3,3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.56 mm

Trade Compliance

LP8725TLX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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