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LP8725TLE/NOPB

Texas Instruments

LP8725TLE/NOPB by Texas Instruments

LP8725TLE/NOPB by Texas Instruments is a Power Management IC with 30 terminals, supporting 9 channels and outputs. It operates b/w -40 to 85°C, with a max output current of 0.8A at a switching frequency of 4000 kHz. Ideal for industrial applications requiring precise power supply support circuits in compact spaces.

Median Price

$2.772

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,500 parts In-Stock

1+ parts

$3.095

100+ parts

$2.712

1k+ parts

$1.532

10k+ parts

-

14,500

$3.095

$2.712

$1.532

-

DigiKey

USA . 240 parts In-Stock

1+ parts

$4.370

100+ parts

$2.759

1k+ parts

$2.496

10k+ parts

$2.396

240

$4.370

$2.759

$2.496

$2.396

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

500

-

$2.190

$1.960

$1.850

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

$2.313

500

-

-

$2.450

$2.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,236 parts In-Stock

1+ parts

$2.024

100+ parts

-

1k+ parts

-

10k+ parts

-

3,236

$2.024

-

-

-

Vyrian

USA . 1,850 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

-

10k+ parts

-

1,850

$2.130

-

-

-

Anansix

USA . 1,207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,207

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 451 parts In-Stock

1+ parts

$1.917

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$1.917

-

-

-

Parana Technologies

USA . 1,614 parts In-Stock

1+ parts

$13.752

100+ parts

-

1k+ parts

$14.239

10k+ parts

-

1,614

$13.752

-

$14.239

-

IDEA Electronic Components Group

UK . 1,960 parts In-Stock

1+ parts

$15.452

100+ parts

$14.679

1k+ parts

$13.907

10k+ parts

-

1,960

$15.452

$14.679

$13.907

-

ChromeModa Solutions

Germany . 290 parts In-Stock

1+ parts

$15.452

100+ parts

$12.671

1k+ parts

-

10k+ parts

-

290

$15.452

$12.671

-

-

DigiPath Technology Company

USA . 715 parts In-Stock

1+ parts

-

100+ parts

$13.932

1k+ parts

-

10k+ parts

-

715

-

$13.932

-

-

Overview

Elevate your power management game with the LP8725TLE/NOPB by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers yet again with this Power Management ICs. Perfect for a wide range of applications, this product offers unparalleled value, benefits, and advantages to customers. Say goodbye to worries about power supply support circuits with the LP8725TLE/NOPB – it's time to experience seamless power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a cost-effective solution for the package, making the product budget-friendly.

Surface Mount: YES

The surface mount feature allows for easy installation on a PCB, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6V supply voltage is within the standard range for many applications, providing compatibility with a wide variety of devices.

No. of Terminals: 30

Having 30 terminals allows for multiple connections and functionalities, making the product versatile for different circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Output Voltage: 0.8 V

The minimum output voltage of 0.8V ensures compatibility with low-power devices, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3V meets the requirements for many electronic devices, making the product suitable for various applications.

Terminal Position: BOTTOM

The bottom terminal position allows for easy routing of connections, optimizing PCB layout and saving space.

Width (mm): 2.56 mm

The narrow width of 2.56mm saves space on the PCB, making it ideal for compact designs or applications with limited board real estate.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product is essential for ensuring stable power delivery and efficient operation of electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures the product's reliability during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for robust soldering connections, ensuring long-term durability of the product.

Length: 2.96 mm

The compact length of 2.96mm further contributes to the product's space-saving design, making it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh operating conditions, making the product suitable for industrial applications.

Maximum Switching Frequency: 4000 kHz

The high maximum switching frequency of 4000kHz allows for fast and efficient power management, making the product ideal for applications requiring high-speed operation.

Maximum Output Current: 0.8 A

The maximum output current of 0.8A provides sufficient power delivery for various electronic devices, making the product versatile for different applications.

No. of Channels: 9

Having 9 channels allows the product to handle multiple power outputs simultaneously, making it suitable for complex circuit designs.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, ensuring consistent performance in demanding environments.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on the PCB, making the product suitable for compact electronic devices.

Maximum Supply Voltage (Vsup): 4.5 V

The maximum supply voltage of 4.5V provides flexibility for use with various power sources, making the product versatile for different applications.

No. of Outputs: 9

Having 9 outputs allows for multiple power delivery options, making the product suitable for complex electronic systems requiring multiple voltage levels.

Technical Specifications

Power Management ICs LP8725TLE/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B30

JESD-609 Code:

e1

Length:

2.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

9

No. of Functions:

1

No. of Outputs:

9

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.8 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

4000 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.56 mm

Trade Compliance

LP8725TLE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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