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LP8556TMX-E02/NOPB

Texas Instruments

LP8556TMX-E02/NOPB by Texas Instruments

LP8556TMX-E02/NOPB by Texas Instruments is a Graphics Display Driver with 12 power supplies (V) and 6 channels. It operates b/w -30 to 85 °C, has a terminal pitch of 0.4 mm, and uses SERIAL data input mode. Ideal for LED display driver applications.

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 360,953 parts In-Stock

1+ parts

$1.160

100+ parts

$0.958

1k+ parts

$0.518

10k+ parts

-

360,953

$1.160

$0.958

$0.518

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,448 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

10k+ parts

-

3,448

$1.102

-

-

-

Vyrian

USA . 3,042 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,042

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 113 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$1.044

-

-

-

Microchip USA

USA . 2,606 parts In-Stock

1+ parts

$4.591

100+ parts

-

1k+ parts

-

10k+ parts

-

2,606

$4.591

-

-

-

Parana Technologies

USA . 1,482 parts In-Stock

1+ parts

$9.770

100+ parts

$907.332

1k+ parts

$8.793

10k+ parts

-

1,482

$9.770

$907.332

$8.793

-

DigiPath Technology Company

USA . 1,616 parts In-Stock

1+ parts

$10.758

100+ parts

-

1k+ parts

-

10k+ parts

-

1,616

$10.758

-

-

-

ChromeModa Solutions

Germany . 6,716 parts In-Stock

1+ parts

$10.978

100+ parts

$9.002

1k+ parts

-

10k+ parts

-

6,716

$10.978

$9.002

-

-

IDEA Electronic Components Group

UK . 768 parts In-Stock

1+ parts

$10.978

100+ parts

$10.429

1k+ parts

$9.880

10k+ parts

-

768

$10.978

$10.429

$9.880

-

AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$18.060

100+ parts

-

1k+ parts

-

10k+ parts

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539

$18.060

-

-

-

Lixinc

USA . 17,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,970

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,786

-

-

-

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Alle Elektronik GmbH

Germany . 1,857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,857

-

-

-

-

Overview

Elevate your display experience with the LP8556TMX-E02/NOPB by Texas Instruments, a cutting-edge Graphics Display Driver that delivers unparalleled performance and reliability. Texas Instruments, known for its superior quality and innovation, has designed this product to meet the demands of today's advanced display technology. Whether you're looking to enhance your digital signage, automotive infotainment systems, or industrial displays, this product offers unmatched value, efficiency, and versatility. Trust Texas Instruments to elevate your display solutions to the next level with the LP8556TMX-E02/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable electronics.

Data Input Mode: SERIAL

Enable serial communication for efficient data transfer and control.

Surface Mount: YES

Easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Support for higher voltage inputs, making it versatile for different power sources.

Package Shape: RECTANGULAR

Sleek and compact design for easy integration into electronic devices.

Power Supplies (V): 12

Support for multiple power supplies for stable operation.

No. of Terminals: 20

Sufficient number of terminals for connection to other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

High-density packaging for optimized space utilization on PCBs.

Minimum Supply Voltage: 1.62 V

Support for low voltage inputs, enhancing compatibility with various systems.

Maximum Operating Temperature: 85 °C

Operational in a wide temperature range for reliable performance in different environments.

Minimum Operating Temperature: -30 °C

Can operate in extreme cold conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish for optimal conductivity and corrosion resistance.

Terminal Position: BOTTOM

Easy access for soldering and connecting to other components.

Maximum Seated Height: 0.675 mm

Low profile design for compact and slim electronic devices.

Width: 1.715 mm

Narrow width for space-saving installation on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Sustainable at peak reflow temperature for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly.

Length: 2.376 mm

Compact length for space-efficient PCB layout.

No. of Channels: 6

Multiple channels for driving and controlling display segments effectively.

Terminal Form: BALL

Ball terminal form for secure and reliable connections.

Input Characteristics: STANDARD

Standard input characteristics for easy integration with existing systems.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent device performance.

No. of Segments: 12

Sufficient number of segments for displaying information accurately.

Terminal Pitch: 0.4 mm

Fine terminal pitch for precise connections and compact design.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed for driving LED display units for clear and bright visuals.

Technical Specifications

Graphics Display Drivers LP8556TMX-E02/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

2.376 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Channels:

6

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.715 mm

Trade Compliance

LP8556TMX-E02/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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