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LP3943ISQX

Texas Instruments

LP3943ISQX by Texas Instruments

LP3943ISQX by Texas Instruments is a Graphics Display Driver with SERIAL data input mode. It operates b/w -40 to 85 °C, with supply voltages of 2.3-5.5 V. Ideal for LED display driver applications due to its compact CHIP CARRIER package and 16 segments support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,648 parts In-Stock

1+ parts

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8,648

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R&J Components

USA . 6,085 parts In-Stock

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6,085

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Anansix

USA . 754 parts In-Stock

1+ parts

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754

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

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750

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Digiode

USA . 695 parts In-Stock

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695

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,047 parts In-Stock

1+ parts

$5.379

100+ parts

$499.537

1k+ parts

$4.841

10k+ parts

-

2,047

$5.379

$499.537

$4.841

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DigiPath Technology Company

USA . 1,216 parts In-Stock

1+ parts

$5.923

100+ parts

$5.449

1k+ parts

-

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1,216

$5.923

$5.449

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IDEA Electronic Components Group

UK . 1,970 parts In-Stock

1+ parts

$6.044

100+ parts

-

1k+ parts

$5.440

10k+ parts

-

1,970

$6.044

-

$5.440

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ChromeModa Solutions

Germany . 883 parts In-Stock

1+ parts

$6.044

100+ parts

$4.956

1k+ parts

-

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883

$6.044

$4.956

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Corohmni

South Africa . 1,208 parts In-Stock

1+ parts

$10.046

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1,208

$10.046

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Semicontronic

India . 710 parts In-Stock

1+ parts

$18.500

100+ parts

$18.038

1k+ parts

$17.945

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710

$18.500

$18.038

$17.945

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AZTECH Wire

Italy . 500 parts In-Stock

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$18.562

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500

$18.562

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Ampacity Inc.

Singapore . 801 parts In-Stock

1+ parts

$20.500

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801

$20.500

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One Stop Electronics

USA . 861 parts In-Stock

1+ parts

$46.500

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861

$46.500

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Lixinc

USA . 17,611 parts In-Stock

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17,611

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Continental Prestige Electronics

USA . 2,243 parts In-Stock

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2,243

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Corphita

USA . 914 parts In-Stock

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914

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Microchip USA

USA . 389 parts In-Stock

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389

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 167 parts In-Stock

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167

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Overview

Elevate your display experience with the LP3943ISQX by Texas Instruments, a top-tier manufacturer known for quality and innovation. As a leading player in the Graphics Display Drivers category, this product offers seamless data input via SERIAL mode, making it ideal for a wide range of applications. With a maximum supply voltage of 5.5V and a minimum supply voltage of 2.3V, this chip carrier package delivers reliable performance in industrial settings. Enjoy the benefits of superior design and cutting-edge technology with the LP3943ISQX – the perfect solution for your display driver needs.

Feature Benefit Bullets

Data Input Mode: SERIAL

Serial data input mode allows for efficient communication and control, making it easy to interface with other devices.

Surface Mount: YES

Surface mount technology saves space and allows for compact designs, making this product suitable for applications where size is a constraint.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, providing flexibility in various applications.

Package Shape: SQUARE

The square package shape is standardized and easy to work with, making assembly and integration into systems straightforward.

Power Supplies (V): 2.5/5

Multiple power supply options allow for compatibility with different systems and power requirements, enhancing the product's versatility.

No. of Terminals: 24

Having a higher number of terminals allows for more connectivity options and flexibility in designing custom circuits or integrating into existing systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offers different thermal management options and profile choices, catering to various application needs.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage ensures efficient power consumption and compatibility with systems that require lower voltage operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated thermal conditions, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions, making this product suitable for a wide range of environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and electrical conductivity, ensuring reliable connections and ease of assembly.

Terminal Position: QUAD

The quad terminal position offers increased connectivity options and ease of integration into circuit layouts, enhancing flexibility and customization.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for slim designs and compact installations, making this product suitable for space-constrained applications.

Width: 4 mm

The compact width dimension makes this product suitable for applications where space is limited and a small footprint is required.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the reflow soldering process without degradation, ensuring robust and reliable assembly.

Length: 4 mm

The short length dimension contributes to the compact form factor of this product, making it ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures that this product can operate reliably in demanding industrial environments, providing long-term durability and performance.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and offers environmental benefits, making this product an environmentally friendly choice.

Nominal Supply Voltage: 5 V

The nominal supply voltage specification ensures compatibility with standard 5V systems, simplifying integration and reducing the need for additional voltage regulators.

No. of Segments: 16

Having multiple segments allows for versatile display options and customizable configurations, making this product suitable for various display driver applications.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and precise connectivity, making this product suitable for applications where space is a premium.

Interface IC Type: LED DISPLAY DRIVER

Being an LED display driver interface IC type, this product is specifically designed for driving LED displays, ensuring efficient communication and control for LED-based applications.

Technical Specifications

Graphics Display Drivers LP3943ISQX attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LP3943ISQX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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