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LP3933SL

Texas Instruments

LP3933SL by Texas Instruments

LP3933SL by Texas Instruments is a SEGMENT display driver with SERIAL data input mode. It operates at 2.7V power supply, suitable for LED displays with 12 segments. With a temperature range of -40 to 85 °C, it's ideal for industrial applications requiring high reliability and performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,033 parts In-Stock

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Anansix

USA . 2,547 parts In-Stock

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2,547

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Electronics Depot

USA . 2,036 parts In-Stock

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2,036

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Inventory MP

USA . 634 parts In-Stock

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634

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Bristol Electronics

USA . 634 parts In-Stock

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634

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Digiode

USA . 443 parts In-Stock

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443

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AZTECH Wire

Italy . 852 parts In-Stock

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$5.758

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852

$5.758

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Parana Technologies

USA . 422 parts In-Stock

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$12.893

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$13.377

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422

$12.893

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DigiPath Technology Company

USA . 569 parts In-Stock

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$14.196

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$13.061

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569

$14.196

$13.061

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ChromeModa Solutions

Germany . 6,501 parts In-Stock

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$14.486

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$11.879

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$14.486

$11.879

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IDEA Electronic Components Group

UK . 1,365 parts In-Stock

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$14.486

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$13.762

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$13.037

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$14.486

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$13.037

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One Stop Electronics

USA . 1,273 parts In-Stock

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$49.500

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Kepictronics

USA . 13,510 parts In-Stock

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Assy Fe

Spain . 13,510 parts In-Stock

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Corphita

USA . 4,119 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,818 parts In-Stock

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Overview

Enhance your display solutions with the LP3933SL by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This Graphics Display Driver offers seamless integration, easy data input, and versatile applications in various industries. With a compact design and low power consumption, this product provides exceptional value and benefits to customers seeking high-performance solutions. Elevate your projects with the LP3933SL and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Display Mode: SEGMENT

Segment display mode allows for clear and organized information display, making it suitable for applications requiring precise visual representation.

Data Input Mode: SERIAL

Serial data input mode enables efficient and fast data transfer, making the product suitable for applications where quick updates and real-time data processing are essential.

Surface Mount: YES

Surface mount compatibility allows for easy integration into PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 2.9 V

A maximum supply voltage of 2.9V ensures stable operation and protects the device from potential voltage spikes, enhancing reliability.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient placement on circuit boards and enables compact designs, improving overall product aesthetics and functionality.

Power Supplies (V): 2.7

Stable power supply voltage of 2.7V ensures consistent performance and reduces the risk of malfunctions or data errors.

No. of Terminals: 32

A high number of terminals (32) provide ample connectivity options and flexibility in circuit design, accommodating various input and output requirements.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers enhanced thermal performance, improved signal integrity, and reduced electromagnetic interference, contributing to overall product reliability and longevity.

Minimum Supply Voltage: 2.65 V

A minimum supply voltage of 2.65V ensures the device can operate efficiently under low power conditions, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high ambient temperatures and harsh environmental conditions, increasing its versatility for use in a wide range of applications.

Minimum Operating Temperature: -40 °C

An operating temperature range of -40°C ensures reliable performance in cold environments, making the product suitable for outdoor or industrial applications where temperature extremes are common.

Terminal Finish: Nickel/Gold (Ni/Au)

Nickel/gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-lasting and reliable connections for the product.

Terminal Position: QUAD

Quad terminal position facilitates easy installation and maintenance, simplifying assembly processes and reducing the risk of errors during deployment.

Width: 4.5 mm

A compact width of 4.5mm allows for space-efficient integration within electronic devices, enabling sleek and streamlined product designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, the product can undergo efficient soldering processes without compromising its structural integrity or performance.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235°C ensures proper solder reflow during manufacturing, contributing to reliable connections and overall product quality.

Length: 5.5 mm

A length of 5.5mm offers a balanced form factor, providing a good compromise between compactness and accessibility during installation and handling.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the product can withstand harsh operating environments, making it suitable for industrial applications that require robust performance.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations, reducing hazardous substances and promoting eco-friendly manufacturing practices.

Nominal Supply Voltage: 2.775 V

A nominal supply voltage of 2.775V enables stable and efficient operation, ensuring consistent performance in various applications.

No. of Segments: 12

With 12 segments, the product supports multi-segment displays, allowing for versatile and customizable visual output in different user interfaces.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm enables precise connections and compact layout designs, enhancing reliability and signal integrity within the circuit.

Minimum fmax: 13 MHz

A minimum fmax of 13MHz ensures high-speed data processing and signal transmission, making the product suitable for applications that require rapid response times.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate moisture sensitivity, allowing for safe and controlled reflow processes during manufacturing, leading to reliable product quality.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface IC type offers compatibility with LED display systems, ensuring seamless integration and efficient driving of LED segments for optimal visual performance.

Technical Specifications

Graphics Display Drivers LP3933SL attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Additional Features:

COMMON-ANODE

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-XQCC-N32

JESD-609 Code:

e4

Length:

5.5 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.16X.24,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.7

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Maximum Supply Voltage:

2.9 V

Minimum Supply Voltage:

2.65 V

Nominal Supply Voltage:

2.775 V

Maximum Supply Voltage-1:

6 V

Minimum Supply Voltage-1:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Gold (Ni/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.5 mm

Minimum fmax:

13 MHz

Trade Compliance

LP3933SL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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