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LP3936SL

Texas Instruments

LP3936SL by Texas Instruments

LP3936SL by Texas Instruments is a SEGMENT display driver with SERIAL data input mode. Operating voltage range of 3-6V, INDUSTRIAL grade, and 32 terminals make it ideal for LED displays in various applications. Chip carrier package style with 0.8mm seated height and -40 to 85°C temperature range ensures reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,282 parts In-Stock

1+ parts

-

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5,282

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Vyrian

USA . 3,690 parts In-Stock

1+ parts

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3,690

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Anansix

USA . 2,187 parts In-Stock

1+ parts

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2,187

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 726 parts In-Stock

1+ parts

$5.278

100+ parts

-

1k+ parts

$5.902

10k+ parts

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726

$5.278

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$5.902

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DigiPath Technology Company

USA . 2,018 parts In-Stock

1+ parts

$5.811

100+ parts

$5.346

1k+ parts

-

10k+ parts

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2,018

$5.811

$5.346

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ChromeModa Solutions

Germany . 2,885 parts In-Stock

1+ parts

$5.930

100+ parts

$4.863

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-

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2,885

$5.930

$4.863

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IDEA Electronic Components Group

UK . 1,232 parts In-Stock

1+ parts

$5.930

100+ parts

-

1k+ parts

$5.337

10k+ parts

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1,232

$5.930

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$5.337

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AZTECH Wire

Italy . 684 parts In-Stock

1+ parts

$7.146

100+ parts

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684

$7.146

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One Stop Electronics

USA . 155 parts In-Stock

1+ parts

$43.500

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155

$43.500

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Lixinc

USA . 13,148 parts In-Stock

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13,148

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Alle Elektronik GmbH

Germany . 4,462 parts In-Stock

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4,462

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Corphita

USA . 3,723 parts In-Stock

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3,723

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Kepictronics

USA . 3,200 parts In-Stock

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3,200

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Assy Fe

Spain . 3,200 parts In-Stock

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3,200

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Microchip USA

USA . 192 parts In-Stock

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192

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Overview

Elevate your display designs with the LP3936SL by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional Graphics Display Drivers like this one. Perfect for a variety of applications, this SEGMENT display driver offers SERIAL data input mode and a compact rectangular package shape. With a nominal supply voltage of 3.6V and industrial temperature grade, this chip carrier is a top choice for designers looking to enhance their projects. Trust in Texas Instruments to provide reliable solutions that exceed expectations.

Feature Benefit Bullets

Display Mode: SEGMENT

Segment display mode allows for precise control and individual control of each segment, providing flexibility in displaying information.

Data Input Mode: SERIAL

Serial data input mode allows for easy integration with microcontrollers and other digital systems, simplifying the design and implementation process.

Surface Mount: YES

Surface mount design enables easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 6 V

Support for a maximum supply voltage of 6 V allows for compatibility with a wide range of power sources, making it suitable for various applications.

Package Shape: RECTANGULAR

Rectangular package shape is practical and space-efficient, making it easy to handle and install in electronic devices.

Power Supplies (V): 3.6

3.6V power supply ensures low power consumption and efficient performance, making it ideal for battery-operated devices.

No. of Terminals: 32

With 32 terminals, this display driver offers ample connectivity options, allowing for versatile and complex circuit designs.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier style with a very thin profile offers compactness and reliability, enabling slim and sleek product designs.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3 V ensures compatibility with low-power components and systems, enhancing flexibility in design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this display driver can withstand high temperatures and harsh environmental conditions, ensuring reliable performance in industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C allows for reliable performance in cold environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position provides stability and improved signal integrity, ensuring reliable connectivity and communication with external components.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8 mm, this display driver is compact and space-saving, making it suitable for slim and compact devices.

Width: 4.5 mm

The narrow width of 4.5 mm enables easy integration and placement on PCBs, facilitating efficient circuit layout and design.

Maximum Time At Peak Reflow Temperature (s): 30

Support for a maximum time of 30 seconds at peak reflow temperature ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for efficient and reliable soldering of the display driver on PCBs, ensuring proper functionality and performance.

Length: 5.5 mm

The compact length of 5.5 mm offers space-saving benefits and easy integration into electronic devices, allowing for streamlined product designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making it suitable for a wide range of industrial applications.

Terminal Form: NO LEAD

No lead terminal form offers environmental benefits and complies with RoHS regulations, making it an environmentally friendly choice for electronics manufacturing.

Nominal Supply Voltage: 3.6 V

Stable nominal supply voltage of 3.6 V ensures consistent performance and operation, making it reliable for a variety of electronic applications.

No. of Segments: 9

Nine segments provide ample display options and flexibility in presenting information, making it suitable for a variety of display applications.

Terminal Pitch: 0.5 mm

Compact terminal pitch of 0.5 mm allows for high-density mounting and space-efficient PCB design, enabling compact and efficient electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring safe storage and handling of the display driver during assembly and manufacturing processes.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface offers compatibility with LED display modules, enabling seamless integration and control of LED-based displays for various applications.

Technical Specifications

Graphics Display Drivers LP3936SL attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Additional Features:

COMMON-ANODE

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-XQCC-N32

Length:

5.5 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

9

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.16X.24,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.5 mm

Trade Compliance

LP3936SL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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