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LP3910SQX-AK/NOPB

Texas Instruments

LP3910SQX-AK/NOPB by Texas Instruments

LP3910SQX-AK/NOPB by Texas Instruments is a 48-terminal Power Management IC with 5V nominal voltage. It features a square package shape, -40 to 85°C operating temperature range, and supports 7 channels for industrial applications. The IC has a very thin profile, matte tin terminal finish, and adjustable threshold with a max supply voltage of 6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,200 parts In-Stock

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8,200

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Digiode

USA . 4,528 parts In-Stock

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4,528

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Distributors (Availability)

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Ampacity Inc.

Singapore . 330 parts In-Stock

1+ parts

$0.500

100+ parts

-

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330

$0.500

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Semicontronic

India . 1,516 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

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1,516

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 777 parts In-Stock

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$6.420

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777

$6.420

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One Stop Electronics

USA . 349 parts In-Stock

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$7.500

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349

$7.500

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Parana Technologies

USA . 1,339 parts In-Stock

1+ parts

$17.378

100+ parts

$1,613.824

1k+ parts

$15.640

10k+ parts

-

1,339

$17.378

$1,613.824

$15.640

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DigiPath Technology Company

USA . 1,830 parts In-Stock

1+ parts

$19.135

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1,830

$19.135

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ChromeModa Solutions

Germany . 3,180 parts In-Stock

1+ parts

$19.526

100+ parts

$16.011

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3,180

$19.526

$16.011

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$19.526

100+ parts

$18.550

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$17.573

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188

$19.526

$18.550

$17.573

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Corphita

USA . 2,821 parts In-Stock

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2,821

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Corohmni

South Africa . 465 parts In-Stock

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465

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Microchip USA

USA . 382 parts In-Stock

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382

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Overview

Elevate your power management solutions with the LP3910SQX-AK/NOPB by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled reliability and performance. Ideal for a wide range of applications, this innovative product provides customers with unmatched value and benefits. Say goodbye to power supply issues and hello to seamless operation with the LP3910SQX-AK/NOPB. Experience the difference quality makes with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

A stable supply voltage of 5 V ensures reliable performance of the power management IC, making it suitable for a variety of applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style with a chip carrier, heat sink/slug, and very thin profile allows for efficient heat dissipation and space-saving design in compact devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can withstand high temperature environments, increasing its durability and reliability.

Minimum Operating Temperature: -40 °C

The ability to operate efficiently at low temperatures down to -40°C makes this power management IC suitable for use in a wide range of environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability of the IC.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6 V, this power management IC can handle higher voltage inputs, making it versatile for different power supply requirements.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization and fine-tuning of the power management settings, making it a versatile choice for various applications.

Technical Specifications

Power Management ICs LP3910SQX-AK/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LP3910SQX-AK/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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