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LP3910SQ-AN

Texas Instruments

LP3910SQ-AN by Texas Instruments

LP3910SQ-AN by Texas Instruments is a Power Management IC with 5 channels, adjustable threshold, and 48 terminals. It operates in industrial temperature range (-40 to 85°C) and supports supply voltage from 2.5V to 6V. Ideal for applications requiring compact square package with surface mount capability.

Median Price

$2.464

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,900 parts In-Stock

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4,900

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Digiode

USA . 1,939 parts In-Stock

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1,939

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Bristol Electronics

USA . 45 parts In-Stock

1+ parts

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$2.464

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45

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$2.464

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Microfarads

USA . 42 parts In-Stock

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42

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Distributors (Availability)

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One Stop Electronics

USA . 491 parts In-Stock

1+ parts

$0.500

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491

$0.500

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AZTECH Wire

Italy . 613 parts In-Stock

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$6.129

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613

$6.129

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Parana Technologies

USA . 830 parts In-Stock

1+ parts

$12.076

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$12.488

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830

$12.076

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$12.488

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DigiPath Technology Company

USA . 182 parts In-Stock

1+ parts

$13.298

100+ parts

$12.234

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182

$13.298

$12.234

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ChromeModa Solutions

Germany . 2,050 parts In-Stock

1+ parts

$13.569

100+ parts

$11.127

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2,050

$13.569

$11.127

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IDEA Electronic Components Group

UK . 1,977 parts In-Stock

1+ parts

$13.569

100+ parts

$12.891

1k+ parts

$12.212

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1,977

$13.569

$12.891

$12.212

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 380 parts In-Stock

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Overview

Elevate your power management solutions with the LP3910SQ-AN by Texas Instruments. Featuring top-of-the-line quality and reliability from a trusted manufacturer, this Power Management IC offers a wide range of applications for various industries. With its sleek square package shape and adjustable threshold, customers can expect superior performance and efficiency. Say goodbye to power supply issues and hello to seamless operations with the LP3910SQ-AN. Experience the value and benefits it brings to your projects today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and enabling efficient production processes.

Package Shape: SQUARE

Square shape can provide better thermal dissipation and mechanical stability compared to other shapes, ensuring reliability in operation.

Nominal Supply Voltage (Vsup): 5 V

Standard 5V supply voltage is commonly used in electronic devices, making this power management IC compatible with a wide range of applications.

No. of Terminals: 48

High number of terminals allows for multiple connectivity options, facilitating complex circuit designs and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier package style with heat sink/slug and very thin profile enhances thermal management and space efficiency, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for operation in extreme cold conditions, making it suitable for various environmental settings.

Terminal Position: QUAD

Quad terminal position offers increased connectivity options and flexibility in circuit board layout, enabling versatile applications.

Maximum Seated Height: 0.8 mm

Low maximum seated height minimizes the overall size profile of the IC, making it suitable for thin and compact electronic devices.

Width (mm): 6 mm

Compact width dimension enables space-efficient integration into circuit designs, suitable for applications with limited board space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power supply support circuit, this IC provides efficient and stable power management functions, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement allows for operation in low-power applications, offering versatility in power supply options.

Length: 6 mm

Balanced length dimension provides a compact and space-efficient form factor, suitable for applications requiring minimal footprint.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions, making it suitable for industrial and automotive applications.

No. of Channels: 5

Multiple channels offer enhanced functionality and power distribution capabilities, suitable for applications requiring multiple power outputs.

Terminal Form: NO LEAD

No-lead terminal form provides reliable solder connections and improves thermal performance, enhancing overall durability and reliability of the IC.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for precise connection and space-saving layout on circuit boards, facilitating high-density designs with increased functionality.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage capacity enables compatibility with a wide range of power sources, making it suitable for diverse applications.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization of voltage levels and power management settings, providing flexibility in application-specific requirements.

Technical Specifications

Power Management ICs LP3910SQ-AN attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

Length:

6 mm

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width (mm):

6 mm

Trade Compliance

LP3910SQ-AN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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