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LP3905SDX-A3/NOPB

Texas Instruments

LP3905SDX-A3/NOPB by Texas Instruments

LP3905SDX-A3/NOPB by Texas Instruments is a 14-terminal Power Management IC with Vsup range of 3-5.5V, operating at -40 to 85°C. It features voltage-mode control, supports up to 0.6A output current, and has a max switching frequency of 2000 kHz. Ideal for industrial applications requiring compact power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,679 parts In-Stock

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4,679

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Digiode

USA . 1,942 parts In-Stock

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1,942

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Anansix

USA . 357 parts In-Stock

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357

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One Stop Electronics

USA . 212 parts In-Stock

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$0.500

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212

$0.500

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AZTECH Wire

Italy . 641 parts In-Stock

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$7.885

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641

$7.885

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Parana Technologies

USA . 145 parts In-Stock

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$16.797

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$17.045

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145

$16.797

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$17.045

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DigiPath Technology Company

USA . 1,914 parts In-Stock

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$18.496

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1,914

$18.496

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IDEA Electronic Components Group

UK . 1,645 parts In-Stock

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$18.873

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$17.929

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$16.986

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1,645

$18.873

$17.929

$16.986

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ChromeModa Solutions

Germany . 726 parts In-Stock

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$18.873

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$15.476

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726

$18.873

$15.476

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QUARKTWIN TECHNOLOGY LTD

USA . 11,783 parts In-Stock

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Corphita

USA . 4,416 parts In-Stock

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Microchip USA

USA . 140 parts In-Stock

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Overview

Experience the next level of power management with the LP3905SDX-A3/NOPB by Texas Instruments. Renowned for their superior quality and innovation, Texas Instruments delivers cutting-edge solutions in the Power Management ICs category. This small outline, heat sink design offers a very thin profile, making it ideal for a wide range of industrial applications. With adjustable thresholds and a maximum output current of 0.6A, this product provides unmatched value, efficiency, and reliability for customers looking to optimize their power supply support circuits. Elevate your designs with Texas Instruments LP3905SDX-A3/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making it convenient for various applications.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V ensures stable and efficient power management for connected devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can perform reliably in various environmental conditions.

Maximum Output Current: 0.6 A

The maximum output current of 0.6A allows for powering multiple components efficiently, making it suitable for a wide range of devices.

Maximum Switching Frequency: 2000 kHz

A high maximum switching frequency of 2000 kHz enables quick response and efficient power regulation for smooth operation.

Technical Specifications

Power Management ICs LP3905SDX-A3/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

S-PDSO-N14

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.16,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2000 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LP3905SDX-A3/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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