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LP3910SQ-AM

Texas Instruments

LP3910SQ-AM by Texas Instruments

LP3910SQ-AM by Texas Instruments is a Power Management IC with 5 channels, Vsup range of 2.5V to 6V, and adjustable threshold. It comes in a square chip carrier package with very thin profile suitable for industrial applications requiring precise power supply support circuits. Operating temperature ranges from -40°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,208 parts In-Stock

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Digiode

USA . 1,600 parts In-Stock

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Semicontronic

India . 529 parts In-Stock

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$0.500

100+ parts

$0.488

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$0.485

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529

$0.500

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$0.485

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One Stop Electronics

USA . 451 parts In-Stock

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$1.500

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$1.500

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AZTECH Wire

Italy . 489 parts In-Stock

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$6.994

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489

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Ampacity Inc.

Singapore . 401 parts In-Stock

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$7.500

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401

$7.500

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Parana Technologies

USA . 2,069 parts In-Stock

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$11.477

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$11.891

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2,069

$11.477

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$11.891

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DigiPath Technology Company

USA . 521 parts In-Stock

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$12.638

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521

$12.638

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ChromeModa Solutions

Germany . 6,629 parts In-Stock

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$12.896

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$10.575

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IDEA Electronic Components Group

UK . 24 parts In-Stock

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$12.896

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$12.251

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$11.606

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24

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$11.606

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Corohmni

South Africa . 460 parts In-Stock

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Corphita

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Overview

Elevate your power management with the LP3910SQ-AM by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a variety of applications, this product is designed to optimize performance and efficiency. With its advanced features and innovative design, the LP3910SQ-AM provides customers with exceptional value and benefits. Experience the advantages of Texas Instruments technology and upgrade your power management solutions today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

A stable and commonly used supply voltage of 5V ensures compatibility with a wide range of electronic devices and systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style provides efficient heat dissipation and a compact form factor, making it suitable for space-constrained applications while ensuring reliable operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this power management IC can withstand harsh environmental conditions and extended operation without overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this power management IC suitable for a wide range of industrial and automotive applications, including those in extreme climates.

Width (mm): 6 mm

A compact width of 6mm allows for space-saving integration within tight layout constraints, ideal for modern electronics with minimal physical footprint.

Minimum Supply Voltage (Vsup): 2.5 V

The ability to operate at a low minimum supply voltage of 2.5V ensures compatibility with a variety of power sources and enables energy-efficient design in portable devices.

No. of Channels: 5

With multiple channels available, this power management IC can control and distribute power to different components or subsystems within a device, enhancing functionality and flexibility.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization of power management settings, enabling optimization for specific application requirements and ensuring efficient power delivery.

Technical Specifications

Power Management ICs LP3910SQ-AM attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

Length:

6 mm

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width (mm):

6 mm

Trade Compliance

LP3910SQ-AM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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