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LMK1D1216RGZR

Texas Instruments

LMK1D1216RGZR by Texas Instruments

LMK1D1216RGZR by Texas Instruments is a Clock Driver & Buffer with 0.575 ns Propagation Delay, 1.8V Nominal Voltage, and 30 True Outputs. It is used in applications requiring high-speed signal conditioning and features a CMOS Technology with -40 to 105 °C operating temperature range.

Median Price

$15.098

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,932 parts In-Stock

1+ parts

$11.645

100+ parts

$10.172

1k+ parts

$7.015

10k+ parts

-

14,932

$11.645

$10.172

$7.015

-

DigiKey

USA . 2,123 parts In-Stock

1+ parts

$18.550

100+ parts

$12.787

1k+ parts

$11.994

10k+ parts

$11.489

2,123

$18.550

$12.787

$11.994

$11.489

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,388 parts In-Stock

1+ parts

$11.063

100+ parts

-

1k+ parts

-

10k+ parts

-

1,388

$11.063

-

-

-

Vyrian

USA . 3,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,218

-

-

-

-

Sensible Micro Corp

USA . 341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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341

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,594 parts In-Stock

1+ parts

$7.777

100+ parts

-

1k+ parts

$7.466

10k+ parts

$7.466

3,594

$7.777

-

$7.466

$7.466

Corphita

USA . 607 parts In-Stock

1+ parts

$10.480

100+ parts

-

1k+ parts

-

10k+ parts

-

607

$10.480

-

-

-

AZTECH Wire

Italy . 208 parts In-Stock

1+ parts

$12.460

100+ parts

-

1k+ parts

-

10k+ parts

-

208

$12.460

-

-

-

Parana Technologies

USA . 1,068 parts In-Stock

1+ parts

$24.993

100+ parts

-

1k+ parts

$25.689

10k+ parts

-

1,068

$24.993

-

$25.689

-

DigiPath Technology Company

USA . 1,728 parts In-Stock

1+ parts

$27.520

100+ parts

-

1k+ parts

-

10k+ parts

-

1,728

$27.520

-

-

-

ChromeModa Solutions

Germany . 3,552 parts In-Stock

1+ parts

$28.082

100+ parts

$23.027

1k+ parts

-

10k+ parts

-

3,552

$28.082

$23.027

-

-

IDEA Electronic Components Group

UK . 707 parts In-Stock

1+ parts

$28.082

100+ parts

$26.678

1k+ parts

$25.274

10k+ parts

-

707

$28.082

$26.678

$25.274

-

Component Stockers USA

USA . 9,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,262

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Overview

Enhance the performance and reliability of your electronic devices with the LMK1D1216RGZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality clock drivers & buffers that offer precision and efficiency. Perfect for applications requiring high-speed data processing, this product provides a low propagation delay and a wide voltage range, making it versatile for various electronic projects. Trust in Texas Instruments to deliver superior products that will elevate the functionality of your designs. Upgrade to the LMK1D1216RGZR today and experience the difference in performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.575 ns

The low propagation delay ensures that signals are transmitted quickly and accurately, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexing ensures that input signals are handled efficiently and accurately, improving the overall performance of the clock driver.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a standard supply voltage of 1.8V, making it compatible with a wide range of electronic systems.

No. of Terminals: 48

The high number of terminals allows for flexible connectivity options and supports complex circuit designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this clock driver energy-efficient and reliable.

Minimum Operating Temperature: -40°C

The wide temperature range of -40°C to 105°C ensures that the clock driver can function reliably in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers LMK1D1216RGZR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY

Family:

LMK

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

30

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

150 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.575 ns

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Minimum fmax:

2000 MHz

Trade Compliance

LMK1D1216RGZR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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