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LMH2180YDX/NOPB

Texas Instruments

LMH2180YDX/NOPB by Texas Instruments

LMH2180YDX/NOPB by Texas Instruments is a clock driver with 2.5/5V power supplies, operating from -40 to 85°C. It features a small outline package with 8 terminals and CMOS technology, suitable for industrial applications requiring precise clock signal distribution in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

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3,780

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Vyrian

USA . 3,466 parts In-Stock

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-

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3,466

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Anansix

USA . 1,969 parts In-Stock

1+ parts

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1,969

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,559 parts In-Stock

1+ parts

$3.147

100+ parts

-

1k+ parts

$3.021

10k+ parts

$3.021

1,559

$3.147

-

$3.021

$3.021

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$10.532

100+ parts

-

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747

$10.532

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Parana Technologies

USA . 85 parts In-Stock

1+ parts

$25.442

100+ parts

-

1k+ parts

$26.073

10k+ parts

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85

$25.442

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$26.073

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DigiPath Technology Company

USA . 170 parts In-Stock

1+ parts

$28.014

100+ parts

$25.773

1k+ parts

-

10k+ parts

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170

$28.014

$25.773

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ChromeModa Solutions

Germany . 1,499 parts In-Stock

1+ parts

$28.586

100+ parts

$23.441

1k+ parts

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10k+ parts

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1,499

$28.586

$23.441

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IDEA Electronic Components Group

UK . 770 parts In-Stock

1+ parts

$28.586

100+ parts

$27.157

1k+ parts

$25.727

10k+ parts

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770

$28.586

$27.157

$25.727

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One Stop Electronics

USA . 470 parts In-Stock

1+ parts

$44.000

100+ parts

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470

$44.000

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Corphita

USA . 681 parts In-Stock

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681

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Microchip USA

USA . 309 parts In-Stock

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309

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Overview

Unlock the power of precision and reliability with the LMH2180YDX/NOPB clock driver by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and performance. Ideal for a wide range of applications, this clock driver offers unparalleled value and benefits to customers. Say goodbye to worries about temperature fluctuations or terminal connectivity issues, as this product boasts industrial-grade durability and cutting-edge CMOS technology. Trust Texas Instruments for all your clock driver needs and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for a variety of applications.

Surface Mount: YES

Being surface mount allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Power Supplies (V): 2.5/5

The product can operate on both 2.5V and 5V power supplies, providing flexibility in design and compatibility with different systems.

No. of Terminals: 8

With 8 terminals, the clock driver & buffer can connect to multiple components and devices, enabling efficient signal distribution and management.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in cold environments or during temperature fluctuations.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the clock driver & buffer can meet the demands of industrial applications, where reliability is crucial.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable for signal processing and distribution.

Technical Specifications

Clock Drivers & Buffers LMH2180YDX/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-N8

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LMH2180YDX/NOPB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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