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LMH2180SDE

Texas Instruments

LMH2180SDE by Texas Instruments

LMH2180SDE by Texas Instruments is a clock driver with 2 functions, operating at a max temperature of 85°C. It has a supply voltage range from 2.4V to 5V and offers true outputs up to 75MHz. Ideal for industrial applications requiring precise clock signal distribution in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,511 parts In-Stock

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4,511

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Digiode

USA . 3,544 parts In-Stock

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3,544

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Anansix

USA . 312 parts In-Stock

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312

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Distributors (Availability)

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Andel Nordic

Denmark . 1,898 parts In-Stock

1+ parts

$2.847

100+ parts

-

1k+ parts

$2.733

10k+ parts

$2.733

1,898

$2.847

-

$2.733

$2.733

AZTECH Wire

Italy . 652 parts In-Stock

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$5.248

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652

$5.248

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Parana Technologies

USA . 1,099 parts In-Stock

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$7.142

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$7.654

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1,099

$7.142

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$7.654

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DigiPath Technology Company

USA . 1,127 parts In-Stock

1+ parts

$7.864

100+ parts

$7.235

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1,127

$7.864

$7.235

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ChromeModa Solutions

Germany . 2,860 parts In-Stock

1+ parts

$8.025

100+ parts

$6.580

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2,860

$8.025

$6.580

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IDEA Electronic Components Group

UK . 875 parts In-Stock

1+ parts

$8.025

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$7.222

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875

$8.025

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$7.222

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One Stop Electronics

USA . 225 parts In-Stock

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$10.000

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225

$10.000

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Component Stockers USA

USA . 485 parts In-Stock

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$99.990

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485

$99.990

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Corphita

USA . 3,481 parts In-Stock

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Overview

Enhance your electronic projects with the LMH2180SDE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their clock drivers & buffers. This versatile product comes with standard input conditioning and 2 functions, making it ideal for a wide range of applications. From enhancing signal integrity to improving overall system performance, the LMH2180SDE offers customers exceptional value and benefits. Take your projects to the next level with this high-performance component.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package makes it easy to integrate this clock driver into a compact PCB layout, saving space and simplifying manufacturing processes.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making it versatile for various applications.

No. of Functions: 2

Having two functions in one package provides cost and space savings compared to using multiple separate components for the same tasks.

Nominal Supply Voltage: 2.7V

The nominal supply voltage of 2.7V makes it compatible with a wide range of power sources, enhancing flexibility in design.

Maximum Operating Temperature: 85°C

With a high maximum operating temperature of 85°C, this clock driver is suitable for industrial applications where temperature variations are common.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and reliability in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers LMH2180SDE attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2180

Input Conditioning:

STANDARD

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Minimum fmax:

75 MHz

Trade Compliance

LMH2180SDE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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