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LMH2190TM-38

Texas Instruments

LMH2190TM-38 by Texas Instruments

LMH2190TM-38 clock driver by Texas Instruments features 2 functions, operates at a supply voltage range of 2.5V to 5.5V, and has a package style of grid array with very thin profile. It is suitable for applications requiring precise clock signal distribution in electronic devices operating b/w -20°C to 85°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,814 parts In-Stock

1+ parts

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6,814

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Anansix

USA . 1,047 parts In-Stock

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1,047

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Digiode

USA . 1,026 parts In-Stock

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1,026

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$7.630

100+ parts

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216

$7.630

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Andel Nordic

Denmark . 329 parts In-Stock

1+ parts

$10.066

100+ parts

-

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$9.664

10k+ parts

$9.664

329

$10.066

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$9.664

$9.664

Parana Technologies

USA . 409 parts In-Stock

1+ parts

$14.808

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-

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$15.239

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409

$14.808

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$15.239

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DigiPath Technology Company

USA . 2,069 parts In-Stock

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$16.305

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2,069

$16.305

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IDEA Electronic Components Group

UK . 1,076 parts In-Stock

1+ parts

$16.638

100+ parts

$15.806

1k+ parts

$14.974

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1,076

$16.638

$15.806

$14.974

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ChromeModa Solutions

Germany . 695 parts In-Stock

1+ parts

$16.638

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$13.643

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695

$16.638

$13.643

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One Stop Electronics

USA . 627 parts In-Stock

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$29.000

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627

$29.000

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Corphita

USA . 2,268 parts In-Stock

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Overview

Unlock the power of precision and reliability with the LMH2190TM-38 clock driver by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and performance in every product. Ideal for various applications in the clock drivers & buffers category, this innovative device offers unmatched value, benefits, and advantages to customers. Experience seamless operation, superior efficiency, and enhanced functionality with the LMH2190TM-38, setting new standards in performance excellence. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.5

Optimal supply voltage of 3.5V ensures efficient and reliable performance.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch design saves space on the circuit board and enables high-density integration.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures stability and functionality under harsh environmental conditions.

Technical Specifications

Clock Drivers & Buffers LMH2190TM-38 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2190

Input Conditioning:

STANDARD

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

1.615 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.615 mm

Trade Compliance

LMH2190TM-38 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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