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LMH1982SQ

Texas Instruments

LMH1982SQ by Texas Instruments

LMH1982SQ by Texas Instruments is a clock driver with 32 terminals, operating at 3.3V. It features a square package style and standard input conditioning, suitable for commercial applications requiring a temperature range of 0-70°C. The output characteristics include 3-state functionality, making it ideal for various surface-mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,909 parts In-Stock

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6,909

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Chip Stock

USA . 3,000 parts In-Stock

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3,000

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Digiode

USA . 2,800 parts In-Stock

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2,800

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Anansix

USA . 308 parts In-Stock

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308

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Distributors (Availability)

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Andel Nordic

Denmark . 3,563 parts In-Stock

1+ parts

$1.851

100+ parts

-

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$1.777

10k+ parts

$1.777

3,563

$1.851

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$1.777

$1.777

Vigor

Singapore . 48 parts In-Stock

1+ parts

$10.470

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48

$10.470

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AZTECH Wire

Italy . 439 parts In-Stock

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$10.838

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439

$10.838

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One Stop Electronics

USA . 1,411 parts In-Stock

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$17.000

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1,411

$17.000

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Parana Technologies

USA . 1,165 parts In-Stock

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$28.074

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$43.445

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$28.074

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DigiPath Technology Company

USA . 2,055 parts In-Stock

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$30.913

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2,055

$30.913

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IDEA Electronic Components Group

UK . 2,356 parts In-Stock

1+ parts

$31.544

100+ parts

$29.967

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$28.390

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2,356

$31.544

$29.967

$28.390

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ChromeModa Solutions

Germany . 1,896 parts In-Stock

1+ parts

$31.544

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$25.866

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1,896

$31.544

$25.866

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Component Stockers USA

USA . 240 parts In-Stock

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$99.990

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240

$99.990

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Corphita

USA . 4,774 parts In-Stock

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4,774

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 134 parts In-Stock

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134

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Overview

Enhance your electronic designs with the LMH1982SQ clock driver & buffer by Texas Instruments. With its high-quality construction and reliable performance, this product is a must-have for any project requiring precise timing control. Perfect for a wide range of applications, this square-shaped chip carrier boasts standard input conditioning and 3-state output characteristics. Trust in Texas Instruments to deliver top-notch products like the LMH1982SQ that offer unmatched value and benefits to customers looking for quality components for their next innovation.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, ensuring compatibility with a wide range of devices.

No. of Terminals: 32

Offers a sufficient number of terminals for connecting to various components, enabling versatile usage.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, making it suitable for use in environments with elevated heat levels.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signal, enhancing the functionality of the device.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions, ensuring reliable performance in diverse environmental settings.

Maximum Seated Height: 0.8 mm

Has a low profile design, making it suitable for applications where space is limited.

Terminal Finish: TIN LEAD

Offers good solderability and conductivity, facilitating secure connections during assembly.

Technical Specifications

Clock Drivers & Buffers LMH1982SQ attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

1982

Input Conditioning:

STANDARD

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

LMH1982SQ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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