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LMH1982SQX

Texas Instruments

LMH1982SQX by Texas Instruments

LMH1982SQX by Texas Instruments is a clock driver with 32 terminals, operating at 3.3V. It features a square package style, standard input conditioning, and 3-STATE output characteristics. Ideal for applications requiring precise timing control in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,375 parts In-Stock

1+ parts

-

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4,375

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Anansix

USA . 1,501 parts In-Stock

1+ parts

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1,501

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Digiode

USA . 988 parts In-Stock

1+ parts

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988

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 221 parts In-Stock

1+ parts

$5.751

100+ parts

-

1k+ parts

$5.521

10k+ parts

$5.521

221

$5.751

-

$5.521

$5.521

AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$12.485

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-

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202

$12.485

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Parana Technologies

USA . 1,773 parts In-Stock

1+ parts

$13.133

100+ parts

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$13.636

10k+ parts

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1,773

$13.133

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$13.636

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DigiPath Technology Company

USA . 1,120 parts In-Stock

1+ parts

$14.461

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1,120

$14.461

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IDEA Electronic Components Group

UK . 1,452 parts In-Stock

1+ parts

$14.756

100+ parts

$14.018

1k+ parts

$13.280

10k+ parts

-

1,452

$14.756

$14.018

$13.280

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ChromeModa Solutions

Germany . 53 parts In-Stock

1+ parts

$14.756

100+ parts

$12.100

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53

$14.756

$12.100

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One Stop Electronics

USA . 1,182 parts In-Stock

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$53.000

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1,182

$53.000

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Corphita

USA . 2,597 parts In-Stock

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2,597

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Overview

Elevate your electronic designs with the LMH1982SQX clock driver and buffer by Texas Instruments. Crafted with precision and expertise, this top-tier component offers unparalleled performance and reliability for your circuitry needs. With its surface mount capability and standard input conditioning, this square-shaped package provides seamless integration into a wide range of applications. Whether you're designing consumer electronics or industrial equipment, the LMH1982SQX delivers exceptional value, efficiency, and precision that sets it apart from the rest. Upgrade your projects today with Texas Instruments' cutting-edge clock drivers and buffers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes installation easier and more convenient, allowing for efficient PCB assembly.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is a common and standard voltage level in many electronic devices, ensuring compatibility and ease of integration.

No. of Terminals: 32

Having a high number of terminals provides flexibility and functionality when connecting to other components in a circuit.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state when disabled, providing additional control and flexibility in signal routing.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh or demanding environments.

Technical Specifications

Clock Drivers & Buffers LMH1982SQX attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

1982

Input Conditioning:

STANDARD

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

LMH1982SQX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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