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LMH1228RTVR

Texas Instruments

LMH1228RTVR by Texas Instruments

LMH1228RTVR by Texas Instruments is a consumer IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, making it suitable for industrial applications. With surface mount capability and a low profile design, it offers high performance in compact electronic devices.

Median Price

$30.360

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,823 parts In-Stock

1+ parts

$30.360

100+ parts

$17.600

1k+ parts

-

10k+ parts

-

10,823

$30.360

$17.600

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 870 parts In-Stock

1+ parts

$28.842

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$28.842

-

-

-

Vyrian

USA . 6,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,111

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,023 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

$3.328

10k+ parts

-

1,023

$2.840

-

$3.328

-

ChromeModa Solutions

Germany . 6,016 parts In-Stock

1+ parts

$3.191

100+ parts

$2.617

1k+ parts

-

10k+ parts

-

6,016

$3.191

$2.617

-

-

IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$3.191

100+ parts

-

1k+ parts

$2.872

10k+ parts

-

883

$3.191

-

$2.872

-

AZTECH Wire

Italy . 954 parts In-Stock

1+ parts

$20.820

100+ parts

-

1k+ parts

-

10k+ parts

-

954

$20.820

-

-

-

Corphita

USA . 4,724 parts In-Stock

1+ parts

$27.324

100+ parts

-

1k+ parts

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10k+ parts

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4,724

$27.324

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-

-

Lixinc

USA . 12,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,417

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-

-

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DigiPath Technology Company

USA . 2,051 parts In-Stock

1+ parts

-

100+ parts

$2.877

1k+ parts

-

10k+ parts

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2,051

-

$2.877

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-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

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Overview

Experience top-notch quality and performance with the LMH1228RTVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers innovative solutions for a wide range of applications. This consumer IC boasts a durable plastic/epoxy package body material, making it ideal for various electronic devices. With a compact size and advanced technology, this chip carrier offers reliability and efficiency. Upgrade your products with the LMH1228RTVR and enjoy the benefits of superior performance and unmatched value. Trust Texas Instruments to exceed your expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into electronic devices.

Package Shape: SQUARE

The square shape of the package provides a compact and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand demanding industrial conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Width: 5 mm

The compact width of the package makes it suitable for applications where space is limited.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has a moderate level of moisture sensitivity, making it suitable for a wide range of environments.

Technical Specifications

Other Function Consumer ICs LMH1228RTVR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

LMH1228RTVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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