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LMH1208RTVR

Texas Instruments

LMH1208RTVR by Texas Instruments

LMH1208RTVR by Texas Instruments is a CMOS consumer circuit IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With surface mount capability and nickel palladium gold finish, it offers high performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,687 parts In-Stock

1+ parts

-

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6,687

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Digiode

USA . 3,885 parts In-Stock

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-

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3,885

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,832 parts In-Stock

1+ parts

$3.124

100+ parts

-

1k+ parts

$3.644

10k+ parts

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1,832

$3.124

-

$3.644

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DigiPath Technology Company

USA . 398 parts In-Stock

1+ parts

$3.440

100+ parts

$3.165

1k+ parts

-

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398

$3.440

$3.165

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ChromeModa Solutions

Germany . 1,241 parts In-Stock

1+ parts

$3.510

100+ parts

$2.878

1k+ parts

-

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1,241

$3.510

$2.878

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IDEA Electronic Components Group

UK . 646 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

$3.159

10k+ parts

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646

$3.510

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$3.159

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One Stop Electronics

USA . 726 parts In-Stock

1+ parts

$3.800

100+ parts

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726

$3.800

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AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$13.644

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546

$13.644

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Lixinc

USA . 15,700 parts In-Stock

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15,700

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A-Z Elektronik GmbH

Germany . 5,027 parts In-Stock

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5,027

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Alle Elektronik GmbH

Germany . 3,351 parts In-Stock

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3,351

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Corphita

USA . 2,655 parts In-Stock

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2,655

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Overview

Elevate your consumer electronics with the LMH1208RTVR by Texas Instruments. This high-quality IC offers unparalleled performance and reliability, thanks to the expertise of its manufacturer. Designed for a wide range of applications, this chip carrier is perfect for creating cutting-edge consumer circuits that deliver exceptional results. With its nickel palladium gold finish and industrial-grade temperature rating, the LMH1208RTVR ensures longevity and durability. Experience the value and benefits of Texas Instruments' innovative technology with this versatile and efficient solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for consumer electronic applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs.

Package Shape: SQUARE

Square package shape ensures efficient use of PCB space, ideal for compact consumer devices.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC is suitable for industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for consumer electronic applications.

Technical Specifications

Other Function Consumer ICs LMH1208RTVR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LMH1208RTVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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