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LMH1226RTWT

Texas Instruments

LMH1226RTWT by Texas Instruments

LMH1226RTWT by Texas Instruments is a consumer IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage range of 1.71V to 1.89V. Ideal for industrial applications requiring compact design and surface mount technology.

Median Price

$30.068

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 155 parts In-Stock

1+ parts

$23.600

100+ parts

-

1k+ parts

-

10k+ parts

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155

$23.600

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-

-

Arrow

USA . 58 parts In-Stock

1+ parts

$28.603

100+ parts

$28.270

1k+ parts

-

10k+ parts

-

58

$28.603

$28.270

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-

Verical

USA . 58 parts In-Stock

1+ parts

$28.603

100+ parts

$28.270

1k+ parts

-

10k+ parts

-

58

$28.603

$28.270

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-

Texas Instruments

USA . 7,682 parts In-Stock

1+ parts

$31.533

100+ parts

$18.280

1k+ parts

-

10k+ parts

-

7,682

$31.533

$18.280

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-

Mouser Electronics

USA . 41 parts In-Stock

1+ parts

$40.870

100+ parts

$29.640

1k+ parts

$28.640

10k+ parts

-

41

$40.870

$29.640

$28.640

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DigiKey

USA . 351 parts In-Stock

1+ parts

$41.170

100+ parts

$29.639

1k+ parts

$28.649

10k+ parts

-

351

$41.170

$29.639

$28.649

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,115 parts In-Stock

1+ parts

$19.722

100+ parts

-

1k+ parts

-

10k+ parts

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3,115

$19.722

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-

-

Vyrian

USA . 7,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,309

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 504 parts In-Stock

1+ parts

$2.201

100+ parts

-

1k+ parts

$2.710

10k+ parts

-

504

$2.201

-

$2.710

-

DigiPath Technology Company

USA . 2,271 parts In-Stock

1+ parts

$2.424

100+ parts

-

1k+ parts

-

10k+ parts

-

2,271

$2.424

-

-

-

IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$2.473

100+ parts

-

1k+ parts

$2.226

10k+ parts

-

1,050

$2.473

-

$2.226

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ChromeModa Solutions

Germany . 215 parts In-Stock

1+ parts

$2.473

100+ parts

$2.028

1k+ parts

-

10k+ parts

-

215

$2.473

$2.028

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-

Corphita

USA . 4,374 parts In-Stock

1+ parts

$18.684

100+ parts

-

1k+ parts

-

10k+ parts

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4,374

$18.684

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-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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560

-

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-

Overview

Enhance your electronic designs with the LMH1226RTWT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This Consumer Circuit IC is versatile and perfect for a wide range of applications. With its compact size and innovative design, this chip carrier offers exceptional performance and functionality. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations. Upgrade your projects with the LMH1226RTWT and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and easier placement within a circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform well in a variety of environments without risk of overheating.

Minimum Supply Voltage (Vsup): 1.71 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with a wide range of power sources.

Technical Specifications

Other Function Consumer ICs LMH1226RTWT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH1226RTWT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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