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LMH1226RTWR

Texas Instruments

LMH1226RTWR by Texas Instruments

LMH1226RTWR by Texas Instruments is a consumer circuit IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage range of 1.71V to 1.89V. Suitable for industrial applications requiring compact and low-profile components that can be surface mounted.

Median Price

$28.083

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 42,172 parts In-Stock

1+ parts

$28.083

100+ parts

$16.280

1k+ parts

-

10k+ parts

-

42,172

$28.083

$16.280

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,633 parts In-Stock

1+ parts

$26.679

100+ parts

-

1k+ parts

-

10k+ parts

-

2,633

$26.679

-

-

-

Vyrian

USA . 2,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,096

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 357 parts In-Stock

1+ parts

$3.511

100+ parts

$326.054

1k+ parts

$3.160

10k+ parts

-

357

$3.511

$326.054

$3.160

-

DigiPath Technology Company

USA . 812 parts In-Stock

1+ parts

$3.866

100+ parts

$3.557

1k+ parts

-

10k+ parts

-

812

$3.866

$3.557

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-

ChromeModa Solutions

Germany . 4,242 parts In-Stock

1+ parts

$3.945

100+ parts

$3.235

1k+ parts

-

10k+ parts

-

4,242

$3.945

$3.235

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-

IDEA Electronic Components Group

UK . 1,952 parts In-Stock

1+ parts

$3.945

100+ parts

-

1k+ parts

$3.550

10k+ parts

-

1,952

$3.945

-

$3.550

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AZTECH Wire

Italy . 724 parts In-Stock

1+ parts

$12.240

100+ parts

-

1k+ parts

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724

$12.240

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Ampacity Inc.

Singapore . 41,864 parts In-Stock

1+ parts

$23.870

100+ parts

-

1k+ parts

-

10k+ parts

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41,864

$23.870

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-

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Corphita

USA . 76 parts In-Stock

1+ parts

$25.275

100+ parts

-

1k+ parts

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10k+ parts

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76

$25.275

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,753 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27,753

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Overview

Upgrade your consumer electronics with the LMH1226RTWR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this versatile consumer IC. With a compact square package body and surface mount capability, this IC is perfect for a wide range of applications. From smart home devices to personal gadgets, the LMH1226RTWR offers unmatched value, efficiency, and performance. Trust Texas Instruments to provide you with the best in consumer circuit technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy assembly in modern electronics manufacturing processes.

Package Shape: SQUARE

The square package shape provides efficient use of board space and easy component placement.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics applications, ensuring compatibility and performance.

No. of Terminals: 24

The 24 terminals offer flexibility in connectivity and integration with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style, heat sink/slug, and very thin profile enhance thermal management and space-saving benefits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Width: 4 mm

The compact width of 4mm enables space-efficient placement on a circuit board.

Minimum Supply Voltage (Vsup): 1.71 V

The low minimum supply voltage allows for energy-efficient operation.

Peak Reflow Temperature: 260 C

With a peak reflow temperature of 260 C, the product can withstand lead-free soldering processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and promotes sustainability.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has moderate sensitivity to moisture, suitable for standard storage conditions.

Maximum Supply Voltage (Vsup): 1.89 V

The maximum supply voltage of 1.89 V ensures safe and optimized performance within the specified range.

Technical Specifications

Other Function Consumer ICs LMH1226RTWR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

LMH1226RTWR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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