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LMH0036SQ/NOPB

Texas Instruments

LMH0036SQ/NOPB by Texas Instruments

LMH0036SQ/NOPB by Texas Instruments is a 48-terminal consumer IC with a power supply of 3.3V, suitable for industrial applications. It features a max operating temperature of 85°C and min of -40°C, with a package style of chip carrier in square shape. This CMOS technology IC has a terminal pitch of 0.5mm and matte tin finish, making it ideal for surface mount assembly processes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,981 parts In-Stock

1+ parts

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3,981

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Digiode

USA . 2,074 parts In-Stock

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2,074

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Anansix

USA . 800 parts In-Stock

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800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 457 parts In-Stock

1+ parts

$2.075

100+ parts

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$2.595

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457

$2.075

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$2.595

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ChromeModa Solutions

Germany . 2,476 parts In-Stock

1+ parts

$2.332

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$1.912

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2,476

$2.332

$1.912

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IDEA Electronic Components Group

UK . 402 parts In-Stock

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$2.332

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$2.099

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402

$2.332

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$2.099

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One Stop Electronics

USA . 739 parts In-Stock

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$6.800

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739

$6.800

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AZTECH Wire

Italy . 738 parts In-Stock

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$7.098

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738

$7.098

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Microchip USA

USA . 4,885 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,561 parts In-Stock

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3,561

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DigiPath Technology Company

USA . 1,896 parts In-Stock

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$2.103

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1,896

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$2.103

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Corphita

USA . 369 parts In-Stock

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369

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Overview

Experience the top-notch quality and reliability of Texas Instruments with the LMH0036SQ/NOPB. This versatile consumer circuit IC is perfect for a wide range of applications, offering exceptional performance and efficiency. With its compact square package design and advanced technology, this chip carrier delivers outstanding results while ensuring ease of use. Trust in Texas Instruments to provide you with innovative solutions that exceed your expectations. Choose the LMH0036SQ/NOPB for unparalleled value and benefits in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the IC, ensuring durability and longevity.

Surface Mount: YES

Enables easy and efficient mounting onto circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Operates at a common voltage level, making it compatible with a wide range of other components.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments, increasing the versatility and usability of the IC.

Maximum Seated Height: 0.8 mm

Has a low profile design, allowing for compact and space-saving circuit board layouts.

Technology: CMOS

Consumes minimal power and produces less heat, making it energy-efficient and suitable for portable devices.

Technical Specifications

Other Function Consumer ICs LMH0036SQ/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMH0036SQ/NOPB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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