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LMH0036SQX/NOPB

Texas Instruments

LMH0036SQX/NOPB by Texas Instruments

LMH0036SQX/NOPB by Texas Instruments is a 48-terminal consumer IC with a power supply of 3.3V, operating temperature range of -40 to 85°C, and terminal finish in matte tin. This square-shaped chip carrier is ideal for industrial applications requiring a very thin profile package body material made of plastic/epoxy and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,541 parts In-Stock

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2,541

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Vyrian

USA . 2,046 parts In-Stock

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2,046

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Anansix

USA . 1,659 parts In-Stock

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1,659

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,301 parts In-Stock

1+ parts

$2.952

100+ parts

$274.150

1k+ parts

$2.657

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2,301

$2.952

$274.150

$2.657

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DigiPath Technology Company

USA . 1,333 parts In-Stock

1+ parts

$3.251

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1,333

$3.251

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$3.317

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$2.985

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2,116

$3.317

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$2.985

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ChromeModa Solutions

Germany . 741 parts In-Stock

1+ parts

$3.317

100+ parts

$2.720

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741

$3.317

$2.720

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One Stop Electronics

USA . 1,339 parts In-Stock

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$8.800

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1,339

$8.800

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AZTECH Wire

Italy . 658 parts In-Stock

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$18.575

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658

$18.575

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Microchip USA

USA . 4,794 parts In-Stock

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Corphita

USA . 4,284 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,127 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LMH0036SQX/NOPB by Texas Instruments. This high-quality consumer IC offers unparalleled performance and reliability, thanks to the renowned expertise of its manufacturer. Ideal for a wide range of applications, this chip carrier boasts a very thin profile and quad terminals, making it a versatile solution for your electronics projects. Experience the value and benefits of Texas Instruments' innovation with the LMH0036SQX/NOPB - where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps protect the internal components of the IC, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic circuit boards, saving space and enabling mass production.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V, this IC is compatible with a wide range of electronic devices and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand heat and operate reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the IC can function effectively even in cold environments.

Maximum Seated Height: 0.8 mm

The very thin profile and low seated height of 0.8mm make this IC suitable for compact and space-constrained electronic devices.

Width: 7 mm

With a width of 7mm, this IC can easily fit into standard electronic circuit layouts and designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this IC has a moderate moisture sensitivity level, suitable for standard factory assembly processes and storage conditions.

Maximum Supply Voltage (Vsup): 3.465 V

The maximum supply voltage of 3.465V ensures that the IC remains within safe operating limits even under transient voltage spikes.

Technical Specifications

Other Function Consumer ICs LMH0036SQX/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMH0036SQX/NOPB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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