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LM75CIM-3/NOPB

Texas Instruments

LM75CIM-3/NOPB by Texas Instruments

Texas Instruments' LM75CIM-3/NOPB is an 8-terminal sensor with a 3.3V power supply, operating b/w -55°C to 125°C. With a max current of 1mA, it is ideal for surface mount applications in various industries requiring precise temperature monitoring.

Median Price

$2.310

Lifecycle Status

Suppliers In-Stock

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Component Electronics Inc.

Canada . 25 parts In-Stock

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$1.730

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Digiode

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Vyrian

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Anansix

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Bristol Electronics

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Atlantic Semiconductor

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ComSIT Distribution GmbH

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Prism Electronics

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Sensible Micro Corp

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EMSNET

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North Shore Components

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Speed Components Ltd

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Pegasus Components GmbH

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First Choice Components Inc.

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Sunrise Surplus Inc.

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Connector Distribution Corp

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Right Parts Inc.

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ACDS - Activité Composants Distribution Service

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Nova Conductors

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Ashlea Components Ltd

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Inventory MP

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Microfarads

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Parana Technologies

USA . 1,267 parts In-Stock

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$1.665

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$154.638

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$1.499

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Ampacity Inc.

Singapore . 855 parts In-Stock

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DigiPath Technology Company

USA . 1,292 parts In-Stock

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ChromeModa Solutions

Germany . 6,029 parts In-Stock

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IDEA Electronic Components Group

UK . 1,297 parts In-Stock

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AZTECH Wire

Italy . 269 parts In-Stock

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One Stop Electronics

USA . 1,302 parts In-Stock

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Component Stockers USA

USA . 768 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

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Argo Parts USA

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A-Z Elektronik GmbH

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of precise temperature sensing with the LM75CIM-3/NOPB by Texas Instruments. Known for their top-quality products, Texas Instruments offers reliability and performance in every sensor. Ideal for a range of applications, this sensor provides accurate temperature readings with ease. Say goodbye to guesswork and hello to precision with the LM75CIM-3/NOPB. Trust Texas Instruments to deliver value and efficiency in every product they create. Upgrade your temperature sensing capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package material provides durability and protection for the sensor, ensuring a longer lifespan.

Power Supplies (V): 3.3

Operating at 3.3V makes this sensor compatible with a wide range of electronic systems, increasing its versatility.

No. of Terminals: 8

Having 8 terminals allows for more connections and versatility in how the sensor can be integrated into different systems.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package makes it easier to mount and fit into various designs and configurations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this sensor can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -55 °C

The ability to operate at -55°C ensures that this sensor can be used in cold environments without performance issues.

Maximum Operating Current: 1 mA

Operating at a maximum current of 1mA ensures efficient power consumption, making it suitable for battery-powered applications.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the installation process and allows for easy integration into electronic circuits.

Technical Specifications

Other Function Sensors & Transducers LM75CIM-3/NOPB attributes and parameters. Explore more Other Function Sensors & Transducers devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

8

Maximum Operating Current:

1 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOP8,.25

Package Shape or Style:

Power Supplies (V):

3.3

Sub-Category:

Other Sensors/Transducers

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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