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LM75ADP-T

NXP Semiconductors

LM75ADP-T by NXP Semiconductors

NXP Semiconductors' LM75ADP-T is an 8-terminal sensor with a power supply range of 2.8-5.5V, ideal for applications requiring temp sensing in the -55 to 125°C range. It features a low operating current of 1mA and offers both negative and positive temperature coefficients, making it suitable for surface mount installations in various electronic devices.

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Verical

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Bristol Electronics

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Atlantic Semiconductor

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Nova Conductors

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Ampacity Inc.

Singapore . 6,887 parts In-Stock

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Semicontronic

India . 6,798 parts In-Stock

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Aztec Data Supply Inc.

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Overview

Discover the innovative LM75ADP-T by NXP Semiconductors, a top-quality sensor designed to revolutionize various applications. With a package body material of PLASTIC/EPOXY and a wide power supply range of 2.8-5.5V, this sensor offers unmatched reliability and versatility. From temperature monitoring to industrial automation, this product delivers precise measurements with ease. Trust NXP Semiconductors for cutting-edge technology that enhances performance and efficiency in every application. Elevate your projects with the LM75ADP-T and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and resistance to moisture, making the product suitable for various operating environments.

Power Supplies (V): 2.8/5.5

The wide range of power supply options (2.8V to 5.5V) allows flexibility in powering the sensor in different applications.

No. of Terminals: 8

Having 8 terminals enables versatile connectivity options and allows for more complex functionality in the sensor.

Package Shape or Style: RECTANGULAR

The rectangular shape helps in easy installation and integration of the sensor into various systems or setups.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and performance in demanding or high-temperature environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the sensor to function effectively in cold or extreme temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold finish on terminals ensures good conductivity, corrosion resistance, and longevity of the sensor.

Maximum Operating Current: 1 mA

With a maximum operating current of 1 mA, the sensor consumes low power while delivering accurate and reliable measurements.

Temperature Coef (ppm/°C): NEGATIVE/POSITIVE

The variable temperature coefficient allows for better calibration and compensation of temperature effects on the sensor's performance.

Mounting Feature: SURFACE MOUNT

The surface mounting feature provides easy and secure attachment of the sensor to PCBs or other surfaces, facilitating efficient installation and integration.

Technical Specifications

Other Function Sensors & Transducers LM75ADP-T attributes and parameters. Explore more Other Function Sensors & Transducers devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Mounting Feature:

No. of Terminals:

8

Maximum Operating Current:

1 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSSOP8,.19

Package Shape or Style:

Power Supplies (V):

2.8/5.5

Sub-Category:

Other Sensors

Temperature Coef (ppm/Cel):

NEGATIVE/POSITIVE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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