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HDC3022DEJR

Texas Instruments

HDC3022DEJR by Texas Instruments

HDC3022DEJR by Texas Instruments is a humidity and temperature sensor with 3% accuracy, operating b/w -40 to 125°C. It has a digital voltage output range of 0.4-1.4V, suitable for surface mount applications in various industries like HVAC and weather monitoring.

Median Price

$3.028

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,624 parts In-Stock

1+ parts

$3.028

100+ parts

$2.653

1k+ parts

$1.499

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$3.028

$2.653

$1.499

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

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$2.350

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$2.350

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Digiode

USA . 2,224 parts In-Stock

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$2.877

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2,224

$2.877

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Chip Stock

USA . 16,390 parts In-Stock

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Component Sense

UK . 4,883 parts In-Stock

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Vyrian

USA . 3,559 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,816 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 3,985 parts In-Stock

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$2.350

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Continental Prestige Electronics

USA . 1,047 parts In-Stock

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$2.350

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$2.303

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$2.350

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$2.303

Ampacity Inc.

Singapore . 3,589 parts In-Stock

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$2.530

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Corphita

USA . 1,451 parts In-Stock

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$2.725

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Overview

Elevate your sensing experience with the HDC3022DEJR by Texas Instruments. Crafted with precision and expertise, this humidity and temperature sensor offers top-notch quality and reliability. Perfect for a wide range of applications, this sensor provides accurate readings and seamless performance, making it a must-have for any project. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Explore the endless possibilities with the HDC3022DEJR and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the sensor, making it suitable for various environmental conditions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the sensor.

Body Width: 2.5 inch

The compact body width of 2.5 inches allows for easy integration and installation in tight spaces or applications with limited room.

Maximum Accuracy (%): 3

The high level of accuracy of 3% ensures reliable and precise measurement of humidity and temperature, making it a trustworthy sensor for various applications.

Sensors or Transducers Type: HUMIDITY AND TEMPERATURE SENSOR

The dual functionality as a humidity and temperature sensor provides comprehensive data collection, making it a cost-effective solution for monitoring both parameters with a single sensor.

No. of Terminals: 8

The 8 terminals offer flexibility in connectivity options and allow for more advanced configurations or data outputs.

Body Height: 0.75 mm

The low body height of 0.75 mm contributes to the compact size of the sensor, making it suitable for space-constrained applications.

Package Shape or Style: SQUARE

The square package shape provides a standardized form factor that is easy to work with and integrate into various devices or systems.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage of 1.62 V ensures efficient power consumption, making it an energy-efficient choice for long-term operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the sensor to be used in high-temperature environments without compromising performance.

Output Range: 0.4-1.4V

The wide output range of 0.4-1.4V allows for flexibility in data interpretation and analysis, accommodating different measurement scales or thresholds.

Output Type: DIGITAL VOLTAGE

The digital voltage output type simplifies data processing and communication, enabling easy integration with digital systems or microcontrollers.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions, enhancing the sensor's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides corrosion resistance and ensures long-term reliability in various operating environments.

Output (V): OPEN-DRAIN

The open-drain output configuration allows for easy interfacing with other devices or systems, simplifying integration and data exchange.

Body Length/Diameter: 2.5 mm

The small body length/diameter of 2.5 mm contributes to the overall compact design of the sensor, making it suitable for applications with limited space.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies installation and enables secure attachment to circuit boards or other surfaces, ensuring stability and reliability.

Technical Specifications

Other Function Sensors & Transducers HDC3022DEJR attributes and parameters. Explore more Other Function Sensors & Transducers devices from Texas Instruments

Specs

Maximum Accuracy (%):

3

Additional Features:

IP67

Body Width:

2.5 inch

Body Height:

.75 mm

Body Length/Diameter:

2.5 mm

JESD-609 Code:

e4

Mounting Feature:

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

OPEN-DRAIN

Output Range:

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.09,20

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.62 V

Terminal Finish:

NICKEL PALLADIUM GOLD

Trade Compliance

HDC3022DEJR Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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