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LM3420A12.6MWA

Texas Instruments

LM3420A12.6MWA by Texas Instruments

Texas Instruments' LM3420A12.6MWA is a Power Management IC with 12.6V supply voltage, surface mount capability, and adjustable threshold. Ideal for power supply support circuits in applications requiring an upper terminal position and no-lead package style (Meter).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,757 parts In-Stock

1+ parts

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4,757

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Vyrian

USA . 3,275 parts In-Stock

1+ parts

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3,275

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Anansix

USA . 1,138 parts In-Stock

1+ parts

-

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1,138

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 352 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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352

$2.500

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AZTECH Wire

Italy . 562 parts In-Stock

1+ parts

$8.157

100+ parts

-

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562

$8.157

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Parana Technologies

USA . 470 parts In-Stock

1+ parts

$10.157

100+ parts

-

1k+ parts

$10.696

10k+ parts

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470

$10.157

-

$10.696

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DigiPath Technology Company

USA . 1,092 parts In-Stock

1+ parts

$11.184

100+ parts

$10.289

1k+ parts

-

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1,092

$11.184

$10.289

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ChromeModa Solutions

Germany . 5,712 parts In-Stock

1+ parts

$11.412

100+ parts

$9.358

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5,712

$11.412

$9.358

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IDEA Electronic Components Group

UK . 337 parts In-Stock

1+ parts

$11.412

100+ parts

$10.841

1k+ parts

$10.271

10k+ parts

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337

$11.412

$10.841

$10.271

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Corphita

USA . 3,136 parts In-Stock

1+ parts

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3,136

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Overview

Enhance your power management solutions with the LM3420A12.6MWA from Texas Instruments, a leading manufacturer known for its high-quality products. This versatile power management IC is perfect for a wide range of applications, offering customers reliability and efficiency. Say goodbye to power supply issues with this adjustable threshold device that provides seamless performance. Upgrade your system today with the LM3420A12.6MWA and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing overall product size.

Nominal Supply Voltage (Vsup): 12.6 V

The 12.6V supply voltage provides a stable power source for devices, ensuring consistent and reliable performance.

Package Style (Meter): UNCASED CHIP

The unencased chip package style allows for flexibility in design and customization, making it suitable for various applications.

Terminal Position: UPPER

The upper terminal position enables easy access and connection to other components, simplifying installation and maintenance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit IC type, this product is specifically designed to enhance power management efficiency and stability.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and improves thermal performance, increasing product reliability.

Adjustable Threshold: YES

The adjustable threshold feature allows users to customize voltage levels, providing flexibility in power management settings for different applications.

Technical Specifications

Power Management ICs LM3420A12.6MWA attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

X-XUUC-N

No. of Channels:

1

No. of Functions:

1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage (Vsup):

12.6 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM3420A12.6MWA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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