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LM3420AM5X-8.2

Texas Instruments

LM3420AM5X-8.2 by Texas Instruments

LM3420AM5X-8.2 by Texas Instruments is a Power Management IC with 8.2V nominal voltage, adjustable threshold, and industrial temperature grade. It is a small outline package suitable for power supply support circuits in applications requiring a compact design and reliable performance in temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,210 parts In-Stock

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Digiode

USA . 3,850 parts In-Stock

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3,850

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Anansix

USA . 642 parts In-Stock

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642

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One Stop Electronics

USA . 1,033 parts In-Stock

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$2.500

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1,033

$2.500

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Parana Technologies

USA . 765 parts In-Stock

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$4.799

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$5.307

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765

$4.799

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$5.307

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DigiPath Technology Company

USA . 1,838 parts In-Stock

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$5.284

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$4.861

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1,838

$5.284

$4.861

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ChromeModa Solutions

Germany . 2,342 parts In-Stock

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$5.392

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$4.421

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2,342

$5.392

$4.421

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IDEA Electronic Components Group

UK . 426 parts In-Stock

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$5.392

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$4.853

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426

$5.392

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$4.853

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AZTECH Wire

Italy . 669 parts In-Stock

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$13.125

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669

$13.125

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Corphita

USA . 4,038 parts In-Stock

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4,038

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Kepictronics

USA . 3,000 parts In-Stock

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Microchip USA

USA . 2,154 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,400 parts In-Stock

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Overview

Unlock the power of efficient power management with the LM3420AM5X-8.2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their Power Management ICs. With its compact design and adjustable threshold feature, this product is perfect for a wide range of applications in industrial settings. Experience the value and benefits of superior performance and precision with the LM3420AM5X-8.2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs in manufacturing.

Nominal Supply Voltage (Vsup): 8.2 V

The nominal supply voltage of 8.2V meets the power requirements of the target application, ensuring compatibility and optimal performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, increasing its versatility and reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options, allowing for different configurations and layouts in the circuit design.

Width (mm): 1.6 mm

The compact width of 1.6mm allows for space-saving integration of the product, especially in constrained or compact PCB layouts.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures the product can operate in harsh industrial environments without compromising performance or reliability.

Terminal Form: GULL WING

The gull wing terminal form offers a reliable and secure connection to the PCB, reducing the risk of solder joint failure or disconnection.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and fine-tuning of the power management settings, making the product versatile and adaptable to different requirements.

Technical Specifications

Power Management ICs LM3420AM5X-8.2 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G5

Length:

2.92 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.22 mm

Nominal Supply Voltage (Vsup):

8.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.6 mm

Trade Compliance

LM3420AM5X-8.2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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