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LM3420AM5-12.6

Texas Instruments

LM3420AM5-12.6 by Texas Instruments

LM3420AM5-12.6 by Texas Instruments is a Power Management IC with 12.6V nominal voltage, -40 to 85°C operating temperature range, and adjustable threshold feature. It is used in industrial applications for power supply support circuits due to its small outline package and dual terminal position.

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4

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1k+

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Digiode

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Vyrian

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Anansix

USA . 1,276 parts In-Stock

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Prism Electronics

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One Stop Electronics

USA . 1,323 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 567 parts In-Stock

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$11.149

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Parana Technologies

USA . 501 parts In-Stock

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DigiPath Technology Company

USA . 1,555 parts In-Stock

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$23.606

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$21.718

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ChromeModa Solutions

Germany . 1,115 parts In-Stock

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$24.088

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$19.752

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IDEA Electronic Components Group

UK . 952 parts In-Stock

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$22.884

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$21.679

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$28.065

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$25.539

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A-Z Elektronik GmbH

Germany . 12,542 parts In-Stock

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Alle Elektronik GmbH

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Corphita

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Perfect Parts

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Microchip USA

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Kepictronics

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Overview

Experience superior power management with the LM3420AM5-12.6 by Texas Instruments. Crafted with precision and reliability, this power management IC boasts top-notch quality and performance. Perfect for a wide range of applications in various industries, this product offers unparalleled value and benefits to customers seeking efficient power supply support circuits. Trust Texas Instruments for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and resistance to heat, making this product suitable for industrial use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and facilitating mass production.

Nominal Supply Voltage (Vsup): 12.6 V

Suitable for applications requiring a stable supply voltage at 12.6V.

Maximum Operating Temperature: 85 °C

Can operate reliably in high temperature environments up to 85°C, ideal for industrial applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options, accommodating various circuit layouts.

Width (mm): 1.6 mm

Compact width of 1.6mm allows for space-efficient design and integration in small electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed for power supply support circuits, ensuring reliable and stable voltage regulation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh operating conditions.

Terminal Pitch: 0.95 mm

Fine terminal pitch of 0.95mm allows for precise and secure connections, enhancing overall product reliability.

Adjustable Threshold: YES

Ability to adjust threshold levels provides customization options for different voltage requirements in various applications.

Technical Specifications

Power Management ICs LM3420AM5-12.6 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G5

Length:

2.92 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.22 mm

Nominal Supply Voltage (Vsup):

12.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.6 mm

Trade Compliance

LM3420AM5-12.6 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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