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LM25066IPSQ/NOPB

Texas Instruments

LM25066IPSQ/NOPB by Texas Instruments

LM25066IPSQ/NOPB by Texas Instruments is a Power Management IC with 12V nominal voltage, 500A max output current, and 8mA max supply current. It is used in automotive applications due to its -40 to 125 °C operating temperature range and compact rectangular package style.

Median Price

$3.057

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,951 parts In-Stock

1+ parts

$2.510

100+ parts

$2.460

1k+ parts

$2.410

10k+ parts

-

7,951

$2.510

$2.460

$2.410

-

Texas Instruments

USA . 57,605 parts In-Stock

1+ parts

$4.199

100+ parts

$3.423

1k+ parts

$2.282

10k+ parts

-

57,605

$4.199

$3.423

$2.282

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.640

10k+ parts

$3.562

1,000

-

-

$3.640

$3.562

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.679

10k+ parts

$2.649

1,000

-

-

$2.679

$2.649

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.057

10k+ parts

$2.643

1,000

-

-

$3.057

$2.643

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,933 parts In-Stock

1+ parts

$3.989

100+ parts

-

1k+ parts

-

10k+ parts

-

2,933

$3.989

-

-

-

Chip Stock

USA . 37,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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37,500

-

-

-

-

Vyrian

USA . 6,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,747

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 19,785 parts In-Stock

1+ parts

$2.280

100+ parts

$2.223

1k+ parts

$2.212

10k+ parts

-

19,785

$2.280

$2.223

$2.212

-

Ampacity Inc.

Singapore . 19,691 parts In-Stock

1+ parts

$2.280

100+ parts

-

1k+ parts

-

10k+ parts

-

19,691

$2.280

-

-

-

Corohmni

South Africa . 416 parts In-Stock

1+ parts

$2.679

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$2.679

-

-

-

Corphita

USA . 331 parts In-Stock

1+ parts

$3.779

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$3.779

-

-

-

Parana Technologies

USA . 2,171 parts In-Stock

1+ parts

$12.527

100+ parts

-

1k+ parts

$12.975

10k+ parts

-

2,171

$12.527

-

$12.975

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DigiPath Technology Company

USA . 2,315 parts In-Stock

1+ parts

$13.794

100+ parts

-

1k+ parts

-

10k+ parts

-

2,315

$13.794

-

-

-

ChromeModa Solutions

Germany . 2,804 parts In-Stock

1+ parts

$14.075

100+ parts

$11.542

1k+ parts

-

10k+ parts

-

2,804

$14.075

$11.542

-

-

IDEA Electronic Components Group

UK . 1,566 parts In-Stock

1+ parts

$14.075

100+ parts

$13.371

1k+ parts

$12.668

10k+ parts

-

1,566

$14.075

$13.371

$12.668

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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23,902

-

-

-

-

Technoshack Inc. (Excess)

Canada . 6,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,560

-

-

-

-

A-Z Elektronik GmbH

Germany . 780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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780

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-

-

-

Overview

Power up your devices with the LM25066IPSQ/NOPB from Texas Instruments, a leading manufacturer of Power Management ICs. This surface-mount chip carrier offers a nominal supply voltage of 12V and a maximum output current of 500A, making it perfect for a wide range of applications. With a sleek rectangular package style and automotive-grade temperature grade, this power supply support circuit provides reliability and efficiency in a compact design. Trust Texas Instruments to deliver quality products that bring value and performance to your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 12 V

Compatible with commonly used 12V power supplies, ensuring versatile applicability.

Maximum Operating Temperature: 125 °C

Can operate efficiently even in high temperature environments, making it suitable for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides efficient heat dissipation, resulting in better performance and reliability.

Minimum Supply Voltage (Vsup): 2.9 V

Allows for operation even with low voltage input, increasing flexibility in power source selection.

Maximum Output Current: 500 A

Capable of handling high current loads, making it suitable for power-hungry devices.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature performance, ensuring reliability in vehicular applications.

Technical Specifications

Power Management ICs LM25066IPSQ/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

8 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

2.9 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LM25066IPSQ/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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