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LM25066APSQE/NOPB

Texas Instruments

LM25066APSQE/NOPB by Texas Instruments

LM25066APSQE/NOPB by Texas Instruments is a Power Management IC with 12V supply, 500A output current, and 8mA supply current. It is used in automotive applications due to its -40 to 125 °C operating temperature range and adjustable threshold voltage feature. The IC comes in a rectangular package style with surface mount capability.

Median Price

$4.669

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 192 parts In-Stock

1+ parts

$3.470

100+ parts

$3.400

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$3.330

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-

192

$3.470

$3.400

$3.330

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Texas Instruments

USA . 59,396 parts In-Stock

1+ parts

$4.337

100+ parts

$3.536

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$2.357

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59,396

$4.337

$3.536

$2.357

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Arrow

USA . 1,014 parts In-Stock

1+ parts

$5.562

100+ parts

$3.876

1k+ parts

$3.692

10k+ parts

-

1,014

$5.562

$3.876

$3.692

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Mouser Electronics

USA . 3,788 parts In-Stock

1+ parts

$6.440

100+ parts

$4.170

1k+ parts

$3.770

10k+ parts

-

3,788

$6.440

$4.170

$3.770

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DigiKey

USA . 93 parts In-Stock

1+ parts

$6.440

100+ parts

$4.167

1k+ parts

$3.795

10k+ parts

$3.655

93

$6.440

$4.167

$3.795

$3.655

Verical

USA . 1,014 parts In-Stock

1+ parts

-

100+ parts

$3.771

1k+ parts

$3.692

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1,014

-

$3.771

$3.692

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RS (Exports)

UK . 250 parts In-Stock

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$4.669

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250

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$4.669

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Distributors (In-Stock)

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Digiode

USA . 566 parts In-Stock

1+ parts

$3.296

100+ parts

-

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566

$3.296

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-

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Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$4.147

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86

$4.147

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Vyrian

USA . 8,816 parts In-Stock

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Chip Stock

USA . 7,520 parts In-Stock

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Anansix

USA . 2,062 parts In-Stock

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Component Sense

UK . 803 parts In-Stock

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803

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Cyclops Electronics Ltd

UK . 287 parts In-Stock

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287

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Prism Electronics

USA . 40 parts In-Stock

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40

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,470 parts In-Stock

1+ parts

$2.380

100+ parts

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8,470

$2.380

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Semicontronic

India . 8,470 parts In-Stock

1+ parts

$2.380

100+ parts

$2.320

1k+ parts

$2.309

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8,470

$2.380

$2.320

$2.309

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Corphita

USA . 1,265 parts In-Stock

1+ parts

$3.123

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1,265

$3.123

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Argo Parts USA

USA . 2,951 parts In-Stock

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$4.147

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2,951

$4.147

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Parana Technologies

USA . 1,713 parts In-Stock

1+ parts

$15.805

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$16.165

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1,713

$15.805

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$16.165

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ChromeModa Solutions

Germany . 3,042 parts In-Stock

1+ parts

$17.758

100+ parts

$14.562

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3,042

$17.758

$14.562

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IDEA Electronic Components Group

UK . 1,839 parts In-Stock

1+ parts

$17.758

100+ parts

$16.870

1k+ parts

$15.982

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1,839

$17.758

$16.870

$15.982

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QUARKTWIN TECHNOLOGY LTD

USA . 13,638 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,999 parts In-Stock

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Perfect Parts

USA . 4,465 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,999 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 1,850 parts In-Stock

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Lixinc

USA . 1,506 parts In-Stock

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DigiPath Technology Company

USA . 676 parts In-Stock

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$16.011

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676

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$16.011

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Overview

Enhance your power management solutions with the LM25066APSQE/NOPB by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs like this one, designed for various applications. With its compact design and high performance, this chip carrier offers precise power supply support with a nominal supply voltage of 12V. Perfect for automotive use, this product ensures reliable operation even in extreme temperatures. Upgrade your power management system today with the LM25066APSQE/NOPB for efficient and effective results.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCBs, saving time and effort in assembly process.

Nominal Supply Voltage (Vsup): 12 V

Suitable for applications requiring a 12V power supply.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without issues.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions as well.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant terminal finish.

Width (mm): 4 mm

Compact size allows for efficient use of space on PCBs.

Minimum Supply Voltage (Vsup): 2.9 V

Can work with lower voltage inputs, increasing flexibility of use.

Maximum Output Current: 500 A

Capable of handling high output currents for powering various components.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture, ensuring reliability in humid conditions.

Adjustable Threshold: YES

Allows for customization of voltage threshold, adapting to different requirements.

Technical Specifications

Power Management ICs LM25066APSQE/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.6 VOLT

Adjustable Threshold:

YES

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

8 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

2.9 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.6V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LM25066APSQE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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