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JM38510/65503BSA

Texas Instruments

JM38510/65503BSA by Texas Instruments

JM38510/65503BSA by Texas Instruments is an 8-bit bus driver with a propagation delay of 22ns at 6V. It features a MILITARY temperature grade, TRUE output polarity, and 3-STATE output characteristics. Ideal for applications requiring bidirectional control in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,651 parts In-Stock

1+ parts

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5,651

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Digiode

USA . 1,697 parts In-Stock

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1,697

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$6.266

100+ parts

-

1k+ parts

$6.016

10k+ parts

$6.016

1,000

$6.266

-

$6.016

$6.016

AZTECH Wire

Italy . 538 parts In-Stock

1+ parts

$8.739

100+ parts

-

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538

$8.739

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One Stop Electronics

USA . 249 parts In-Stock

1+ parts

$12.000

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-

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249

$12.000

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$14.374

100+ parts

$13.080

1k+ parts

$11.787

10k+ parts

-

20

$14.374

$13.080

$11.787

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Parana Technologies

USA . 55 parts In-Stock

1+ parts

$17.282

100+ parts

-

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$17.495

10k+ parts

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55

$17.282

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$17.495

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DigiPath Technology Company

USA . 1,670 parts In-Stock

1+ parts

$19.030

100+ parts

$17.507

1k+ parts

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1,670

$19.030

$17.507

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ChromeModa Solutions

Germany . 4,223 parts In-Stock

1+ parts

$19.418

100+ parts

$15.923

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4,223

$19.418

$15.923

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IDEA Electronic Components Group

UK . 1,633 parts In-Stock

1+ parts

$19.418

100+ parts

$18.447

1k+ parts

$17.476

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1,633

$19.418

$18.447

$17.476

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Microchip USA

USA . 2,913 parts In-Stock

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2,913

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Corphita

USA . 2,275 parts In-Stock

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2,275

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Overview

Enhance your electronic designs with the JM38510/65503BSA bus driver and transceiver from Texas Instruments. Crafted with precision and reliability, this ceramic, glass-sealed component offers seamless integration into various applications. With a MILITARY-grade screening level and 3-STATE output characteristics, this product ensures optimal performance at extreme temperatures. Experience the benefits of true output polarity and common control in a compact flatpack package style. Trust Texas Instruments for quality components that deliver unmatched value and efficiency for all your design needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 22 ns

Fast propagation delay ensures quick response time in data transmission.

Surface Mount: YES

Easy to mount on circuit boards for convenient installation.

Package Shape: RECTANGULAR

Space-efficient design for compact electronic systems.

Nominal Supply Voltage / Vsup (V): 6

Optimal supply voltage for efficient performance.

Output Characteristics: 3-STATE

Allows for high impedance output for bus sharing.

Temperature Grade: MILITARY

Suitable for use in rugged military environments.

Technology: CMOS

Low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers JM38510/65503BSA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Logic IC Type:

Maximum I (ol):

7.8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

6

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.92 mm

Trade Compliance

JM38510/65503BSA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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