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JM38510/65102BCA

Texas Instruments

JM38510/65102BCA by Texas Instruments

JM38510/65102BCA by Texas Instruments is a CMOS Logic Gates IC with 3 functions, 3 inputs, and 27ns propagation delay. Ideal for military applications due to MIL-M-38510 Class B screening level and wide operating temperature range (-55°C to 125°C). Package style: IN-LINE, Terminal finish: TIN LEAD, Supply voltage: 2-6V.

Median Price

$36.045

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Rochester

USA . 236 parts In-Stock

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$32.040

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$28.670

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$26.980

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Verical

USA . 236 parts In-Stock

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$40.050

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$35.837

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$33.725

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DigiKey

USA . 170 parts In-Stock

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Digiode

USA . 544 parts In-Stock

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$29.402

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Vyrian

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Resion

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Bristol Electronics

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Atlantic Semiconductor

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Electronic Expediters

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Mil-Aero Solutions, Inc.

USA . 69 parts In-Stock

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Microfarads

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Component Sense

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R&J Components

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ACDS - Activité Composants Distribution Service

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Contempo Components LLC

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First Choice Components Inc.

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Electronics Depot

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Corel Iberica Componentes, S.L.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$11.891

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$10.821

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$9.751

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$11.891

$10.821

$9.751

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Parana Technologies

USA . 974 parts In-Stock

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$25.408

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$2,359.492

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$22.867

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974

$25.408

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$22.867

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Component Stockers USA

USA . 2,733 parts In-Stock

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$27.310

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$25.670

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$20.600

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Corphita

USA . 1,819 parts In-Stock

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$27.855

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DigiPath Technology Company

USA . 946 parts In-Stock

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ChromeModa Solutions

Germany . 4,956 parts In-Stock

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$28.548

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$23.409

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IDEA Electronic Components Group

UK . 144 parts In-Stock

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$28.548

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$27.121

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$25.693

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Enhance your electronic projects with the JM38510/65102BCA by Texas Instruments. With a reputation for high-quality components, Texas Instruments delivers superior logic gates that are ideal for a wide range of applications. Whether you're working on industrial automation or consumer electronics, this product offers reliability and performance. Benefit from fast propagation delays, multiple functions, and a MIL-M-38510 Class B screening level. Trust in Texas Instruments for top-notch technology that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 27 ns

Fast propagation delay ensures quick response time, making it ideal for applications requiring high-speed operation.

No. of Functions: 3

Offers versatility and flexibility in designing circuits with multiple logic functions in a single component.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of existing systems and circuits.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environmental conditions or applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall efficiency of the product.

Packing Method: TUBE

Convenient packaging in tubes helps in easy handling, storage, and transportation of the product.

Technical Specifications

Logic Gates JM38510/65102BCA attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

6.67 mm

Trade Compliance

JM38510/65102BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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