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JM38510/07903BEA

Texas Instruments

JM38510/07903BEA by Texas Instruments

JM38510/07903BEA by Texas Instruments is a MILITARY-grade Multiplexer with 4 functions, 2 inputs, and 16 terminals. It operates at temperatures from -55 to 125 °C and has a propagation delay of 7.5 ns. Ideal for applications requiring high-speed signal switching in harsh environments.

Median Price

$11.596

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Freelance Electronics

USA . 745 parts In-Stock

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$11.596

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$12.176

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Vyrian

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Electronic Expediters

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Digiode

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Mil-Aero Solutions, Inc.

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Resion

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Bristol Electronics

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North Shore Components

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Inland Empire Components Inc.

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Manoshevitz Elec. Sales

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Classic Components Corporation

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Prism Electronics

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MISTER SPROCKETS

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Odi Ramu Company

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Semi Source

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First Choice Components Inc.

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Sogenti Electronics

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Lantek

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Sunrise Surplus Inc.

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AZTECH Wire

Italy . 357 parts In-Stock

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Parana Technologies

USA . 780 parts In-Stock

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$9.577

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$10.174

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DigiPath Technology Company

USA . 369 parts In-Stock

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ChromeModa Solutions

Germany . 3,938 parts In-Stock

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IDEA Electronic Components Group

UK . 1,059 parts In-Stock

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One Stop Electronics

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Corphita

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Microchip USA

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GreenTree Electronics

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Overview

Unlock the power of seamless data processing with the JM38510/07903BEA by Texas Instruments. Crafted with precision and expertise, this multiplexer & demultiplexer offers unparalleled quality and reliability. Ideal for military-grade applications, this versatile product boasts a range of functions and features that ensure optimal performance. Experience the value of efficiency and accuracy with Texas Instruments, where innovation meets excellence. Elevate your projects to new heights with the JM38510/07903BEA – your trusted partner in advanced technology solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 4

Allows for multiple operations to be carried out simultaneously, increasing efficiency and versatility.

Screening Level: MIL-M-38510 Class B

Meets military standards for reliability and quality, making it a dependable choice for critical applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power sources, ensuring ease of integration into existing systems.

Propagation Delay (tpd): 7.5 ns

Delivers fast response times, ideal for high-speed data transfer requirements.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in a variety of environments.

Technology: TTL

Uses TTL technology, known for its reliability and simplicity, making it a practical choice for users.

Technical Specifications

Multiplexer & Demultiplexer JM38510/07903BEA attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

78 mA

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

JM38510/07903BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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