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ISO7810FDW

Texas Instruments

ISO7810FDW by Texas Instruments

ISO7810FDW by Texas Instruments is a 16-terminal IC with a supply voltage range of 2.25V to 5.5V, operating b/w -55°C to 125°C. It features GULL WING terminals and is suitable for military-grade applications requiring small outline packages in CMOS technology.

Median Price

$5.292

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,908 parts In-Stock

1+ parts

$4.293

100+ parts

$3.761

1k+ parts

$2.125

10k+ parts

-

1,908

$4.293

$3.761

$2.125

-

Mouser Electronics

USA . 97 parts In-Stock

1+ parts

$6.290

100+ parts

-

1k+ parts

$3.660

10k+ parts

-

97

$6.290

-

$3.660

-

DigiKey

USA . 11 parts In-Stock

1+ parts

$6.290

100+ parts

$4.310

1k+ parts

$3.661

10k+ parts

$3.561

11

$6.290

$4.310

$3.661

$3.561

Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$3.310

1k+ parts

$2.960

10k+ parts

$2.780

30

-

$3.310

$2.960

$2.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,701 parts In-Stock

1+ parts

$2.802

100+ parts

-

1k+ parts

-

10k+ parts

-

4,701

$2.802

-

-

-

Vyrian

USA . 2,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,647

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 448 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$2.655

-

-

-

Parana Technologies

USA . 187 parts In-Stock

1+ parts

$10.310

100+ parts

-

1k+ parts

$10.834

10k+ parts

-

187

$10.310

-

$10.834

-

DigiPath Technology Company

USA . 346 parts In-Stock

1+ parts

$11.352

100+ parts

-

1k+ parts

-

10k+ parts

-

346

$11.352

-

-

-

ChromeModa Solutions

Germany . 1,865 parts In-Stock

1+ parts

$11.584

100+ parts

$9.499

1k+ parts

-

10k+ parts

-

1,865

$11.584

$9.499

-

-

IDEA Electronic Components Group

UK . 710 parts In-Stock

1+ parts

$11.584

100+ parts

$11.005

1k+ parts

$10.426

10k+ parts

-

710

$11.584

$11.005

$10.426

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

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Overview

Discover the superior quality and reliability of the Texas Instruments ISO7810FDW, a cutting-edge Interface IC designed for a range of applications. With a robust package body material and advanced technology, this product offers unmatched performance and durability. From military-grade temperature tolerance to seamless surface mount installation, the ISO7810FDW delivers convenience and efficiency. Trust in Texas Instruments' reputation for excellence and elevate your projects with the value and benefits of this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable eliminates the need for through-hole soldering, making the assembly process more efficient and cost-effective.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in various applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient space utilization on PCBs, maximizing component density.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, enabling the interface IC to interact with multiple components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves valuable board space, making it suitable for compact electronic devices.

Minimum Supply Voltage: 2.25 V

Can operate at low supply voltages, ideal for applications where power efficiency is crucial.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments and under heavy loads.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature makes this IC suitable for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for easier and more secure soldering during assembly.

Maximum Seated Height: 2.65 mm

Low seated height minimizes the overall profile of the IC, making it suitable for slim electronic devices.

Width: 7.5 mm

Compact width dimension allows for efficient placement on the PCB, saving space for other components.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering of the IC during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures the reliability of solder joints and component connections.

Length: 10.3 mm

Moderate length dimension provides a balance between space efficiency and component accessibility for maintenance.

Temperature Grade: MILITARY

Military-grade temperature range ensures operation in harsh environmental conditions and high reliability in critical applications.

Technology: CMOS

CMOS technology offers low power consumption, making the IC energy-efficient and suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support during soldering and enhances the IC's overall durability.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration with standard PCB layouts and components.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

Specialized interface circuit type optimizes signal transmission and translation between different parts of an electronic system.

Technical Specifications

Other Function Interface ICs ISO7810FDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE VCC2 FROM 2.25 -5.5V; ALSO OPERATE WITH 3.3V AND 5 V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7810FDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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