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ISO7730FQDBQRQ1

Texas Instruments

ISO7730FQDBQRQ1 by Texas Instruments

ISO7730FQDBQRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with 3 functions, operating at -40 to 125 °C. It features a small outline package with 16 terminals and a supply voltage range of 2.25V to 5.5V, making it ideal for automotive applications requiring high reliability in harsh environments.

Median Price

$1.886

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,961 parts In-Stock

1+ parts

$1.523

100+ parts

$1.258

1k+ parts

$0.680

10k+ parts

-

16,961

$1.523

$1.258

$0.680

-

Mouser Electronics

USA . 2,647 parts In-Stock

1+ parts

$2.250

100+ parts

$1.970

1k+ parts

$1.410

10k+ parts

$1.290

2,647

$2.250

$1.970

$1.410

$1.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,007 parts In-Stock

1+ parts

$1.447

100+ parts

-

1k+ parts

-

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4,007

$1.447

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-

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Vyrian

USA . 6,263 parts In-Stock

1+ parts

-

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1k+ parts

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6,263

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-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,731 parts In-Stock

1+ parts

$1.290

100+ parts

-

1k+ parts

-

10k+ parts

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8,731

$1.290

-

-

-

Corphita

USA . 2,736 parts In-Stock

1+ parts

$1.371

100+ parts

-

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2,736

$1.371

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-

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Parana Technologies

USA . 1,945 parts In-Stock

1+ parts

$12.156

100+ parts

-

1k+ parts

$12.567

10k+ parts

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1,945

$12.156

-

$12.567

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IDEA Electronic Components Group

UK . 1,008 parts In-Stock

1+ parts

$13.658

100+ parts

$12.975

1k+ parts

$12.292

10k+ parts

-

1,008

$13.658

$12.975

$12.292

-

ChromeModa Solutions

Germany . 954 parts In-Stock

1+ parts

$13.658

100+ parts

$11.200

1k+ parts

-

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954

$13.658

$11.200

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Corohmni

South Africa . 126 parts In-Stock

1+ parts

$13.959

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126

$13.959

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QUARKTWIN TECHNOLOGY LTD

USA . 13,705 parts In-Stock

1+ parts

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13,705

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

1+ parts

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10,000

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Lixinc

USA . 7,489 parts In-Stock

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7,489

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Argo Parts USA

USA . 3,575 parts In-Stock

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3,575

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Continental Prestige Electronics

USA . 2,770 parts In-Stock

1+ parts

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2,770

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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DigiPath Technology Company

USA . 677 parts In-Stock

1+ parts

-

100+ parts

$12.314

1k+ parts

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10k+ parts

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677

-

$12.314

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Overview

Elevate your automotive applications with the top-tier quality of the ISO7730FQDBQRQ1 by Texas Instruments. Crafted with precision and expertise, this Interface IC offers unmatched reliability and performance in a compact package. Whether you're looking to enhance safety systems or streamline communication networks, this versatile product delivers optimal functionality and seamless integration. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and provide good protection for electronic components, ensuring the longevity of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and cost during manufacturing.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs without getting damaged.

No. of Functions: 3

Having multiple functions in a single IC can save space on the circuit board and reduce the need for additional components, simplifying the overall design.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the product meets the quality and reliability standards required for automotive applications, making it a dependable choice.

Package Shape: RECTANGULAR

Rectangular package shapes are space-efficient and easy to handle during assembly, making the product suitable for compact electronic devices.

No. of Terminals: 16

Having a sufficient number of terminals allows for versatile connections and functionalities, making the product adaptable to a variety of applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the circuit board and provides better thermal performance, enhancing the overall efficiency of the product.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, this product can operate efficiently even with lower power sources, making it versatile for a range of electronic devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and durability of the product.

Terminal Position: DUAL

Having dual terminal positions allows for flexible mounting options on the circuit board, enabling custom layouts and configurations based on the specific requirements of the application.

Maximum Seated Height: 1.75 mm

The low maximum seated height of the product saves space in electronic devices and allows for compact designs, making it suitable for applications with size constraints.

Width: 3.895 mm

The narrow width of the product enables it to fit easily on the circuit board without occupying excessive space, contributing to a more streamlined and efficient layout.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for a maximum of 30 seconds ensures proper soldering and assembly processes, leading to reliable connections and overall product performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for effective soldering and bonding of the product onto the circuit board, ensuring strong and durable connections.

Length: 4.905 mm

The compact length of the product contributes to its space-saving design, making it suitable for applications with limited board space or size restrictions.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the product is designed to withstand harsh environmental conditions and stringent quality standards, making it a reliable choice for automotive applications.

No. of Channels: 3

Having three channels provides versatility and flexibility in interfacing with multiple components, enabling complex functionalities and enhancing the overall performance of the product.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the product energy-efficient and versatile in various applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy surface mounting and secure connections to the circuit board, ensuring reliability and stability in the operation of the product.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V is commonly used in many electronic systems, making the product compatible with a wide range of applications and power sources.

Terminal Pitch: 0.635 mm

The fine terminal pitch of 0.635 mm enables dense packing and precise connections on the circuit board, facilitating efficient signal transmission and compact designs.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product is moderately sensitive to moisture, requiring proper handling and storage, ensuring optimal performance and reliability in various environments.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data transfer between different components, enabling seamless integration and operation of electronic systems.

Technical Specifications

Other Function Interface ICs ISO7730FQDBQRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7730FQDBQRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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