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ISO7242MDWRG4

Texas Instruments

ISO7242MDWRG4 by Texas Instruments

ISO7242MDWRG4 by Texas Instruments is a 16-terminal digital isolator with 4 functions, suitable for automotive applications. It operates b/w -40 to 125 °C with supply voltage range of 3.3V to 5V. With CMOS technology and nickel palladium gold finish, it offers reliable performance in compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 18,030 parts In-Stock

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Vyrian

USA . 5,905 parts In-Stock

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Digiode

USA . 2,040 parts In-Stock

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2,040

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Corohmni

South Africa . 162 parts In-Stock

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$4.696

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162

$4.696

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AZTECH Wire

Italy . 779 parts In-Stock

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$7.339

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779

$7.339

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Parana Technologies

USA . 93 parts In-Stock

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$11.833

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$12.234

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93

$11.833

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$12.234

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DigiPath Technology Company

USA . 143 parts In-Stock

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$13.030

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$11.988

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$13.030

$11.988

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ChromeModa Solutions

Germany . 2,787 parts In-Stock

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$13.296

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$10.903

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IDEA Electronic Components Group

UK . 1,368 parts In-Stock

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$13.296

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$12.631

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$11.966

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$12.631

$11.966

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Semicontronic

India . 1,128 parts In-Stock

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$18.500

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$18.038

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$17.945

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$18.038

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Ampacity Inc.

Singapore . 898 parts In-Stock

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$19.500

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One Stop Electronics

USA . 849 parts In-Stock

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Lixinc

USA . 11,539 parts In-Stock

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Kepictronics

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Corphita

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 2,688 parts In-Stock

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A-Z Elektronik GmbH

Germany . 561 parts In-Stock

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Continental Prestige Electronics

USA . 507 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the power of seamless digital isolation with the Texas Instruments ISO7242MDWRG4. Designed with precision and reliability in mind, this innovative digital isolator offers unparalleled performance in a compact package. Perfect for automotive applications and beyond, this versatile IC boasts 4 functions and a wide range of operating temperatures. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your next project with the ISO7242MDWRG4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, allowing for easy handling and protection of the internal components.

Surface Mount: YES

Surface mount capability makes installation and assembly of this product easier and more efficient, especially in mass production environments.

Maximum Supply Voltage: 5 V

With a maximum supply voltage of 5V, this product can be used in a wide range of applications without risk of damage due to overvoltage.

No. of Functions: 4

Having 4 functions integrated into a single IC simplifies the design and reduces the need for multiple components, leading to a more compact and cost-effective solution.

Package Shape: RECTANGULAR

Rectangular shape of the package allows for efficient use of space on a PCB, optimizing layout and placement of components for better overall performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stable performance even under extreme conditions, making this product suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows this product to function effectively in cold environments, providing versatility and reliability in various temperature conditions.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that this product has a moderate sensitivity to moisture, which is important for ensuring the reliability and longevity of the IC in different environmental conditions.

Technical Specifications

Other Function Interface ICs ISO7242MDWRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.15V TO 5.5V VCC2 SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7242MDWRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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