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ISO7241MDWRG4

Texas Instruments

ISO7241MDWRG4 by Texas Instruments

ISO7241MDWRG4 by Texas Instruments is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3V to 5V, it features CMOS technology and Gull Wing terminal form for robust performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 34,990 parts In-Stock

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34,990

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Vyrian

USA . 2,694 parts In-Stock

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2,694

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Digiode

USA . 2,449 parts In-Stock

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2,449

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 159 parts In-Stock

1+ parts

$9.592

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159

$9.592

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$9.799

100+ parts

$9.309

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$9.309

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50

$9.799

$9.309

$9.309

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Parana Technologies

USA . 1,532 parts In-Stock

1+ parts

$10.378

100+ parts

$963.782

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$9.340

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1,532

$10.378

$963.782

$9.340

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DigiPath Technology Company

USA . 139 parts In-Stock

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$11.428

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139

$11.428

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ChromeModa Solutions

Germany . 1,471 parts In-Stock

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$11.661

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$9.562

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1,471

$11.661

$9.562

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IDEA Electronic Components Group

UK . 1,032 parts In-Stock

1+ parts

$11.661

100+ parts

$11.078

1k+ parts

$10.495

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1,032

$11.661

$11.078

$10.495

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AZTECH Wire

Italy . 254 parts In-Stock

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$14.333

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254

$14.333

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One Stop Electronics

USA . 810 parts In-Stock

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$19.500

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810

$19.500

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Semicontronic

India . 1,170 parts In-Stock

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$22.500

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$21.938

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$21.825

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1,170

$22.500

$21.938

$21.825

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Ampacity Inc.

Singapore . 629 parts In-Stock

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$45.500

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629

$45.500

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Argo Parts USA

USA . 2,696 parts In-Stock

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Continental Prestige Electronics

USA . 2,662 parts In-Stock

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Corphita

USA . 1,025 parts In-Stock

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1,025

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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A-Z Elektronik GmbH

Germany . 364 parts In-Stock

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364

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Overview

Elevate your electronic designs with the ISO7241MDWRG4 by Texas Instruments. This high-quality digital isolator offers unmatched reliability and performance, making it a top choice for a wide range of applications. From automotive to industrial settings, this versatile IC provides exceptional value and benefits to customers seeking a robust and efficient solution. Trust in Texas Instruments' reputation for excellence and experience the advantages of the ISO7241MDWRG4 in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and saves space on PCBs, making it a convenient choice for compact designs.

Maximum Supply Voltage: 5 V

With a high maximum supply voltage, this product is compatible with a wide range of power sources, offering flexibility in usage.

No. of Functions: 4

Equipped with four functions, this product provides multiple capabilities in a single component, streamlining circuit design.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard mounting layouts, facilitating integration into existing systems.

No. of Terminals: 16

With sixteen terminals, this product offers ample connectivity options, enabling versatile connections with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it suitable for applications with limited board real estate.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage requirement enhances energy efficiency and allows operation in lower power environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is reliable in harsh environmental conditions, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables operation in extreme cold climates, expanding the product's usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position offers redundancy and ensures secure connections, reducing the risk of signal loss or interruptions.

Maximum Seated Height: 2.65 mm

The low maximum seated height makes this product suitable for applications with height restrictions, allowing for compact designs.

Width: 7.5 mm

The narrow width dimension saves space on PCBs and enhances layout flexibility, accommodating designs with tight spacing requirements.

Technical Specifications

Other Function Interface ICs ISO7241MDWRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.15V TO 5.5V VCC2 SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7241MDWRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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