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ISO7241MDWG4

Texas Instruments

ISO7241MDWG4 by Texas Instruments

ISO7241MDWG4 by Texas Instruments is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3-5V and CMOS technology, it offers high reliability in compact small outline packaging.

Median Price

$9.020

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 46 parts In-Stock

1+ parts

$9.020

100+ parts

$7.780

1k+ parts

$5.330

10k+ parts

$5.010

46

$9.020

$7.780

$5.330

$5.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

1+ parts

$6.150

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$6.150

-

-

-

Digiode

USA . 2,688 parts In-Stock

1+ parts

$8.569

100+ parts

-

1k+ parts

-

10k+ parts

-

2,688

$8.569

-

-

-

Vyrian

USA . 4,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,324

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,330 parts In-Stock

1+ parts

$6.150

100+ parts

-

1k+ parts

-

10k+ parts

$6.027

1,330

$6.150

-

-

$6.027

Ampacity Inc.

Singapore . 46 parts In-Stock

1+ parts

$7.670

100+ parts

-

1k+ parts

-

10k+ parts

-

46

$7.670

-

-

-

Semicontronic

India . 46 parts In-Stock

1+ parts

$7.670

100+ parts

$7.478

1k+ parts

$7.440

10k+ parts

-

46

$7.670

$7.478

$7.440

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$8.075

100+ parts

$7.671

1k+ parts

$7.671

10k+ parts

-

2,000

$8.075

$7.671

$7.671

-

Corphita

USA . 2,796 parts In-Stock

1+ parts

$8.118

100+ parts

-

1k+ parts

-

10k+ parts

-

2,796

$8.118

-

-

-

Parana Technologies

USA . 1,078 parts In-Stock

1+ parts

$11.419

100+ parts

-

1k+ parts

$11.841

10k+ parts

-

1,078

$11.419

-

$11.841

-

DigiPath Technology Company

USA . 709 parts In-Stock

1+ parts

$12.573

100+ parts

$11.568

1k+ parts

-

10k+ parts

-

709

$12.573

$11.568

-

-

ChromeModa Solutions

Germany . 6,703 parts In-Stock

1+ parts

$12.830

100+ parts

$10.521

1k+ parts

-

10k+ parts

-

6,703

$12.830

$10.521

-

-

IDEA Electronic Components Group

UK . 644 parts In-Stock

1+ parts

$12.830

100+ parts

$12.188

1k+ parts

$11.547

10k+ parts

-

644

$12.830

$12.188

$11.547

-

Corohmni

South Africa . 13 parts In-Stock

1+ parts

$14.049

100+ parts

-

1k+ parts

-

10k+ parts

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13

$14.049

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-

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AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$15.852

100+ parts

-

1k+ parts

-

10k+ parts

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405

$15.852

-

-

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Argo Parts USA

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,320

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$6.027

1k+ parts

$5.843

10k+ parts

$5.720

500

-

$6.027

$5.843

$5.720

A-Z Elektronik GmbH

Germany . 362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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362

-

-

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the ISO7241MDWG4, a cutting-edge digital isolator designed to meet your interface IC needs. With a durable plastic/epoxy package body material and nickel palladium gold terminal finish, this small outline IC offers 4 functions in a compact rectangular shape. Ideal for automotive applications, this product operates seamlessly in temperatures ranging from -40°C to 125°C. Trust in Texas Instruments to deliver exceptional performance and value with the ISO7241MDWG4. Elevate your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring longevity of the product.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving time during assembly.

Maximum Supply Voltage: 5 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 4

Offers multiple functions in a single IC, reducing the need for additional components.

Package Shape: RECTANGULAR

Compact shape allows for space-saving on the PCB.

No. of Terminals: 16

Sufficient terminals for connecting to other components, ensuring compatibility.

Package Style (Meter): SMALL OUTLINE

Small form factor saves space on the PCB, ideal for compact designs.

Minimum Supply Voltage: 3.3 V

Supports lower supply voltages for energy-efficient operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it versatile for various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for alternative mounting options, increasing flexibility.

Maximum Seated Height: 2.65 mm

Low profile design reduces overall height of the product, suitable for slim devices.

Width: 7.5 mm

Compact width saves space on the PCB, ideal for tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering during assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints for reliable performance.

Length: 10.3 mm

Compact length saves space on the PCB, ideal for small form factor designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, suitable for automotive applications.

No. of Channels: 4

Multiple channels allow for versatile connectivity options for different signals.

Technology: CMOS

CMOS technology provides low power consumption and fast switching speeds for efficient performance.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections on the PCB.

Nominal Supply Voltage: 3.3 V

Stable and reliable supply voltage for consistent performance in operation.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into PCB layouts.

Moisture Sensitivity Level (MSL): 2

Low MSL rating ensures the IC is less susceptible to moisture damage.

Interface IC Type: DIGITAL ISOLATOR

Digital isolator interface provides electrical isolation for secure signal transmission.

Technical Specifications

Other Function Interface ICs ISO7241MDWG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.15V TO 5.5V VCC2 SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7241MDWG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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