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ISO7240ADWR

Texas Instruments

ISO7240ADWR by Texas Instruments

ISO7240ADWR by Texas Instruments is a digital isolator with 4 channels, operating at -40 to 125 °C. It has a supply voltage range of 3.15-3.6 V and comes in a small outline package suitable for automotive applications. The IC features gull wing terminals, nickel palladium gold finish, and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,948 parts In-Stock

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Digiode

USA . 922 parts In-Stock

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922

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 342 parts In-Stock

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$10.384

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342

$10.384

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Parana Technologies

USA . 1,824 parts In-Stock

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$11.175

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$11.619

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$11.175

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$11.619

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IDEA Electronic Components Group

UK . 1,418 parts In-Stock

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$12.556

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$11.928

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$11.300

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$12.556

$11.928

$11.300

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ChromeModa Solutions

Germany . 1,248 parts In-Stock

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$12.556

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$10.296

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$12.556

$10.296

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One Stop Electronics

USA . 1,318 parts In-Stock

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$26.500

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$26.500

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Ampacity Inc.

Singapore . 598 parts In-Stock

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$32.500

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Lixinc

USA . 15,310 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,619 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,871 parts In-Stock

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Argo Parts USA

USA . 3,317 parts In-Stock

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Corphita

USA . 2,962 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 306 parts In-Stock

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$11.320

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306

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$11.320

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Overview

Elevate your electronic designs with Texas Instruments' ISO7240ADWR, a premium quality digital isolator that offers unmatched reliability and performance. With its small outline package and dual terminal position, this innovative product provides seamless interface integration for a wide range of applications. From automotive to industrial settings, this versatile IC boasts a nominal supply voltage of 3.3V and a maximum operating temperature of 125°C, ensuring optimal functionality in any environment. Trust in Texas Instruments' expertise and elevate your projects to the next level with the ISO7240ADWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry.

Surface Mount: YES

Surface mount technology allows for easier and more automated assembly processes, making the product suitable for mass production.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage allows for versatile usage in various electronic systems.

No. of Functions: 4

Having multiple functions integrated into a single IC reduces the need for multiple components, saving space and cost.

Package Shape: RECTANGULAR

Rectangular shape is standard and compatible with most circuit board layouts, making integration easier.

No. of Terminals: 16

Having a sufficient number of terminals allows for easy connections and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on the PCB and are suitable for compact electronic devices.

Minimum Supply Voltage: 3.15 V

The low minimum supply voltage ensures stable operation even in low-power scenarios.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the IC suitable for industrial and automotive applications where temperature may vary.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the IC to function in extreme cold conditions as well.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for better stability during soldering and mechanical stress.

Maximum Seated Height: 2.65 mm

Low seated height is important for slim and compact electronic designs.

Width: 7.5 mm

Compact width makes the IC suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The IC can withstand peak reflow temperature for a sufficient duration, ensuring proper soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the IC suitable for lead-free soldering processes.

Length: 10.3 mm

The length of the IC is suitable for standard PCB layouts and designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are designed to withstand harsh conditions and stringent reliability requirements.

No. of Channels: 4

Having multiple channels allows the IC to handle multiple input/output signals, increasing functionality.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and are ideal for surface mount applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is commonly used in electronics, ensuring compatibility with various systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy soldering and PCB assembly processes.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the IC can withstand moderate humidity levels during storage and assembly.

Interface IC Type: DIGITAL ISOLATOR

Being a digital isolator, this IC provides protection against electrical noise and ground potential differences, ensuring signal integrity.

Technical Specifications

Other Function Interface ICs ISO7240ADWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5V TO 5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7240ADWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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