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ISO7230ADW

Texas Instruments

ISO7230ADW by Texas Instruments

ISO7230ADW by Texas Instruments is a 16-terminal interface IC with 3 functions. It operates b/w -40 to 125 °C and has a supply voltage range of 3.15V to 3.6V, making it suitable for automotive applications requiring small outline packages and surface mount capabilities.

Median Price

$3.335

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,900 parts In-Stock

1+ parts

$2.340

100+ parts

$2.290

1k+ parts

$2.250

10k+ parts

-

2,900

$2.340

$2.290

$2.250

-

DigiKey

USA . 413 parts In-Stock

1+ parts

$5.070

100+ parts

$4.306

1k+ parts

$2.680

10k+ parts

-

413

$5.070

$4.306

$2.680

-

Avnet

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.335

10k+ parts

$3.250

480

-

-

$3.335

$3.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,113 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

-

10k+ parts

-

2,113

$3.012

-

-

-

Vyrian

USA . 8,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,324

-

-

-

-

LWI Electronics Inc

India . 277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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277

-

-

-

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Bristol Electronics

USA . 38 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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38

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,039 parts In-Stock

1+ parts

$2.853

100+ parts

-

1k+ parts

-

10k+ parts

-

4,039

$2.853

-

-

-

Parana Technologies

USA . 1,935 parts In-Stock

1+ parts

$6.784

100+ parts

-

1k+ parts

$7.437

10k+ parts

-

1,935

$6.784

-

$7.437

-

DigiPath Technology Company

USA . 1,586 parts In-Stock

1+ parts

$7.471

100+ parts

$6.873

1k+ parts

-

10k+ parts

-

1,586

$7.471

$6.873

-

-

ChromeModa Solutions

Germany . 1,746 parts In-Stock

1+ parts

$7.623

100+ parts

$6.251

1k+ parts

-

10k+ parts

-

1,746

$7.623

$6.251

-

-

IDEA Electronic Components Group

UK . 1,639 parts In-Stock

1+ parts

$7.623

100+ parts

-

1k+ parts

$6.861

10k+ parts

-

1,639

$7.623

-

$6.861

-

AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

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235

$20.000

-

-

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Perfect Parts

USA . 899 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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899

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iodParts Technologies Inc.

India . 200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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200

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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50

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Overview

Discover the unmatched quality and reliability of Texas Instruments with the ISO7230ADW, a cutting-edge Other Function Interface IC designed to meet your application needs with precision. This versatile product boasts a compact package style and advanced features, making it ideal for a wide range of industries. Elevate your projects with this innovative solution that offers exceptional value, performance, and efficiency, setting new standards in interface circuit technology. Experience the difference with Texas Instruments - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, making it versatile for different system requirements.

No. of Functions: 3

Having multiple functions in one IC reduces the need for multiple components, simplifying circuit design and saving board space.

Package Shape: RECTANGULAR

Rectangular package shape is standardized and fits well on circuit boards, making it easy to handle and install in various electronic devices.

No. of Terminals: 16

With a sufficient number of terminals, this IC can accommodate multiple connections and interfaces, enhancing its connectivity and versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style is compact and space-saving, ideal for applications where size constraints are a concern.

Minimum Supply Voltage: 3.15 V

A low minimum supply voltage allows for operation in low-power environments and ensures efficiency in power consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range enables reliable performance in demanding thermal conditions, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliability in cold environments, expanding the range of applications this IC can be used in.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term performance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and connection options, improving compatibility with different PCB layouts.

Maximum Seated Height: 2.65 mm

Low maximum seated height reduces the overall profile of the IC on the PCB, making it suitable for compact and slim designs.

Width: 7.5 mm

Narrow width dimension saves space on the PCB, enabling the integration of other components and ensuring efficient use of board real estate.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes thermal stress on the IC during assembly, preventing damage and ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust soldering processes, ensuring proper connection to the PCB for stable performance.

Length: 10.3 mm

Compact length dimension saves space on the PCB, enabling the design of smaller and more efficient electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in harsh automotive environments with fluctuating temperatures and challenging conditions.

No. of Channels: 3

Multiple channels offer enhanced functionality and connectivity options, making this IC suitable for applications requiring multiple signal processing capabilities.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical support and easy soldering, ensuring reliable connections and robust performance.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage simplifies power management and compatibility with other components, ensuring consistent performance in the system.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration and compatibility with various PCB layouts and assembly processes.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture, making this IC suitable for a wide range of environments and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC facilitates communication between different components or systems, enabling seamless data exchange and interoperability.

Technical Specifications

Other Function Interface ICs ISO7230ADW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5V TO 5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7230ADW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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