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INA231AIYFDT

Texas Instruments

INA231AIYFDT by Texas Instruments

INA231AIYFDT by Texas Instruments is a Power Management IC with 12 terminals, operating b/w -40 to 125 °C. It supports a supply voltage range of 2.7V to 5.5V and has an adjustable threshold feature. Ideal for automotive applications due to its compact size and high-temperature grade suitability.

Median Price

$3.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 500 parts In-Stock

1+ parts

$2.420

100+ parts

$2.120

1k+ parts

$1.198

10k+ parts

-

500

$2.420

$2.120

$1.198

-

DigiKey

USA . 152 parts In-Stock

1+ parts

$4.500

100+ parts

$2.147

1k+ parts

-

10k+ parts

-

152

$4.500

$2.147

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,451 parts In-Stock

1+ parts

$2.299

100+ parts

-

1k+ parts

-

10k+ parts

-

1,451

$2.299

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.340

-

-

-

Vyrian

USA . 5,357 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,357

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 89 parts In-Stock

1+ parts

$2.060

100+ parts

$2.008

1k+ parts

$1.998

10k+ parts

-

89

$2.060

$2.008

$1.998

-

Corphita

USA . 2,415 parts In-Stock

1+ parts

$2.178

100+ parts

-

1k+ parts

-

10k+ parts

-

2,415

$2.178

-

-

-

Continental Prestige Electronics

USA . 3,487 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

-

10k+ parts

$2.293

3,487

$2.340

-

-

$2.293

Argo Parts USA

USA . 1,899 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,899

$2.340

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

$2.223

10k+ parts

$2.176

50

$2.340

-

$2.223

$2.176

Ampacity Inc.

Singapore . 326 parts In-Stock

1+ parts

$4.480

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$4.480

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$5.284

100+ parts

$5.020

1k+ parts

$5.020

10k+ parts

-

100

$5.284

$5.020

$5.020

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Parana Technologies

USA . 1,616 parts In-Stock

1+ parts

$14.064

100+ parts

-

1k+ parts

$14.529

10k+ parts

-

1,616

$14.064

-

$14.529

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AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$14.520

100+ parts

-

1k+ parts

-

10k+ parts

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524

$14.520

-

-

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DigiPath Technology Company

USA . 174 parts In-Stock

1+ parts

$15.486

100+ parts

$14.247

1k+ parts

-

10k+ parts

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174

$15.486

$14.247

-

-

IDEA Electronic Components Group

UK . 2,185 parts In-Stock

1+ parts

$15.802

100+ parts

$15.012

1k+ parts

$14.222

10k+ parts

-

2,185

$15.802

$15.012

$14.222

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ChromeModa Solutions

Germany . 1,225 parts In-Stock

1+ parts

$15.802

100+ parts

$12.958

1k+ parts

-

10k+ parts

-

1,225

$15.802

$12.958

-

-

Corohmni

South Africa . 788 parts In-Stock

1+ parts

$22.647

100+ parts

-

1k+ parts

-

10k+ parts

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788

$22.647

-

-

-

Lixinc

USA . 1,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,753

-

-

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Overview

Enhance the efficiency and reliability of your power management system with the Texas Instruments INA231AIYFDT. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality and innovation in their Power Management ICs. This versatile product is perfect for a wide range of applications, offering precise monitoring and control of power usage. With its surface mount design and adjustable threshold feature, the INA231AIYFDT provides exceptional value and benefits to customers looking to optimize their power systems. Trust Texas Instruments to deliver cutting-edge solutions for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a wide range of devices and systems that require a 3.3V power supply, making it versatile for various applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ensuring reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for a variety of environments and applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The advanced package style allows for efficient heat dissipation and compact design, ideal for space-constrained applications.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for optimal performance.

Width (mm): 1.388 mm

Compact width enables a small footprint on the PCB, ideal for designs with limited space available.

Minimum Supply Voltage (Vsup): 2.7 V

Supports a low supply voltage, making it suitable for power management in energy-efficient devices.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during manufacturing processes, ensuring reliability and durability.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and reliability, suitable for automotive applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of supply voltages, making it versatile for different power management requirements.

Adjustable Threshold: YES

Allows for customization of threshold settings, providing flexibility in power management control.

Technical Specifications

Power Management ICs INA231AIYFDT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B12

JESD-609 Code:

e1

Length:

1.645 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.388 mm

Trade Compliance

INA231AIYFDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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